WMSIC Electronic Components

HGSEMI LM258N

ModelLM258N
PackageDIP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM258N
Type
HGSEMI
Minimum package
50 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM258N
Electronic Component
1
Package
DIP-8
Electronic Component
Operational Amplifier
Electronic Component
0.77g
Electronic Component
1
Electronic Component
BM0264336346
Operating Temperature
25℃~+85℃
Amplifier
2
Output Current
30mA
(SR)
300V/ms
Power Supply Voltage
3V~32V
Static Current(Iq)
1mA
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM258N 产品概述 — HGSEMI(华冠)

一、概述

LM258N 是由 HGSEMI(华冠) 提供的双通道运算放大器,内部包含两只独立的、高增益且频率补偿的放大器单元。器件可在宽电压范围内工作,既支持单电源供电(3V ~ 32V),也可采用双电源工作(±1.5V ~ ±16V),适合电池供电与工业级电源系统。该型号以低功耗、低噪声与良好的直流特性著称,适用于一般模拟信号调理、传感器前端与低频控制回路等场合。

二、主要特性

  • 放大器数量:2(双运放)
  • 最大电源差(Vdd - Vss):32 V
  • 增益带宽积(GBW):700 kHz(适合低频到中频应用)
  • 输入失调电压(Vos):典型 5 mV
  • 输入失调电压温漂(Vos TC):7 µV/℃
  • 压摆率(SR):300 V/ms(≈0.3 V/µs)
  • 输入偏置电流(Ib):250 nA
  • 输入失调电流(Ios):2 nA
  • 输入电压噪声密度(eN):40 nV/√Hz @ 1 kHz
  • 共模抑制比(CMRR):100 dB
  • 输入失调电流温漂(Ios TC):10 pA/℃
  • 静态电流(Iq):约 1 mA(整芯片或每放大器典型值,请参考实际器件数据手册)
  • 输出电流:30 mA(短时驱动能力,需注意热耗散)
  • 工作温度范围:-25 ℃ ~ +85 ℃
  • 封装:未知(请按采购型号或数据手册确认封装形式)

三、主要功能与典型应用

LM258N 以其全面的直流特性、低噪声与低功耗优势,适合多种模拟电路:

  • 传感器信号放大与调理(温度、压力、光电等)
  • 低频滤波器(有源低通、高通、带通)与积分/微分电路
  • 电压跟随(缓冲器)、比较放大(非严格高速比较)
  • 数据采集前端、放大后驱动 ADC 输入
  • 低功耗便携设备与工业控制回路

注意:由于 GBW 与压摆率属于低中档水平,器件更适合音频、传感器与控制类低频场合,不适合高带宽或高速精密采样的前端放大。

四、典型电路与使用要点

  • 供电与去耦:在每个供电引脚与地之间建议并联 0.1 µF 与 10 µF 去耦电容,靠近器件引脚布局以降低寄生和抑制电源振铃。
  • 输入与输出范围:器件支持宽电压供电,但输出并非完全轨到轨;在设计近轨工作时需验证在目标负载下的输出摆幅。
  • 布局注意事项:高阻输入节点要尽量缩短走线并远离高速数字信号与开关电源噪声源;输入防护与滤波有助于降低输入偏置电流带来的误差。
  • 热与功耗:输出驱动大电流或长时间工作在高压差下会增加功耗并升高结温,必要时考虑散热或限制输出负载。
  • 偏置与漂移校正:对于对零漂敏感的应用,可通过外部补偿或下游校准方案降低 Vos 引入的误差;Vos 温漂为 7 µV/℃,在精密测量设计中需要评估环境温度影响。
  • 噪声控制:噪声密度 40 nV/√Hz @1 kHz,适合大多数模拟信号处理;若为极低电平信号放大,建议评估整体噪声预算并视情况采用低噪声放大器。

五、封装与可靠性

当前资料未标注具体封装,请在采购或设计 BOM 时确认所选封装(如 DIP、SOIC、SOP 等)及其引脚排列、热阻参数。器件工作温度 -25 ℃ ~ +85 ℃ 满足普通工业级温度范围;对极端温度或更高可靠性要求的应用,请参考 HGSEMI 的完整数据手册或考虑工业级/车规级替代品。

六、设计与选型建议

  • 若应用需要更高带宽或更快压摆率,请考虑更高 GBW/更大 SR 的运放;若要求更低噪声或更小偏置电流,同样需在器件库中筛选。
  • 对于电池供电或低功耗系统,LM258N 的静态电流(约 1 mA)是一个重要指标,需与系统能耗目标比较决定是否适用。
  • 在传感器接口与精密测量中,关注 Vos、Ib 与其温漂对系统精度的贡献,并在 PCB 布局与软硬件校准上做相应处理。

总结:HGSEMI 的 LM258N 是一款面向通用模拟信号处理的双通道运算放大器,具有宽电源范围、稳定的低频性能和低功耗特性,是传感器调理、音频前端与常规模拟控制电路的经济实用选择。若需更详细的引脚、封装与完整电气特性,请参阅官方数据手册。

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