WMSIC Electronic Components

HGSEMI LM2575HVS-5.0/TR LM2575HVS

ModelLM2575HVS-5.0/TR
PackageTO-263-5
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM2575HVS-5.0 / TR
Type
HGSEMI
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM2575HVS-5.0/TR
Electronic Component
1
Package
TO-263-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
2.274g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227677190
Operating Temperature
40℃~+125℃
Operating Voltage
40V~60V
Switching Frequency
52kHz
Electronic Component
Electronic Component
Output Voltage
5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM2575HVS-5.0/TR 产品概述

一、产品简介

LM2575HVS-5.0/TR 是一款降压型(Buck)开关稳压器产品概述(基于提供参数)。该器件为单通道、固定输出 5.0V 的降压电源芯片,内置开关管,非同步整流结构,适用于输入电压较高的直流电源场景。器件工作电压范围为 40V60V,最大输出电流 1A,典型开关频率约 52kHz,工作温度范围 -40℃+125℃,封装为 TO-263-5,静态电流约 50μA,适合在对功耗、体积和成本有综合要求的工业级应用中使用。

二、主要特性

  • 输入电压范围:40V ~ 60V(适合高压输入场合)
  • 固定输出:5.0V,最大输出电流 1A
  • 开关频率:约 52kHz(有利于外部元件体积与效率折中)
  • 拓扑:降压(Buck),单通道,内置开关管
  • 同步整流:否(需外置肖特基二极管作为续流元件)
  • 静态电流:50μA(待机损耗低)
  • 工作温度:-40℃ ~ +125℃,封装:TO-263-5

三、工作原理简介

芯片通过内部开关管以恒定频率对外部电感进行驱动,控制占空比以实现从高压输入降到稳定的 5V 输出。由于为非同步整流结构,开关关断时输出端电流通过外置肖特基二极管回流。内部含有基本的保护功能(过流、过温保护等),但设计时仍需合理选择外部元件与布局以确保稳定与可靠。

四、典型应用场景

  • 工业控制与仪表:高压母线向 5V 逻辑/传感器供电
  • 通信设备:基板局部降压电源
  • 仪器电源模块:需从高压车载或工业电源得到稳压 5V 输出
  • 其他对高输入电压、高可靠性有要求的嵌入式系统

五、设计与选型要点

  • 续流二极管:选用低正向压降的肖特基二极管,电流与反向电压裕量需大于输出要求(建议≥1A、反向电压≥输入最大值)。
  • 电感选型:根据输出电流与纹波要求选择合适电感值与饱和电流,优先低 DCR、高效率型号。
  • 输出电容:采用低 ESR 的铝电解或固态电容,保证瞬态响应与纹波控制。
  • 输入滤波:由于高输入电压且开关频率中等,输入侧需加足够的滤波与去耦电容,防止干扰回流。
  • 布局与散热:TO-263-5 封装需良好散热路径,增大铜箔面积并靠近散热引脚安放大电流元件;注意开关节点走线短且远离小信号节点,以减少 EMI。

六、可靠性与测试建议

  • 在最大输入电压与最大负载下验证热性能与保护响应;
  • 做负载瞬态与启动/关断测试,确认输出过冲与恢复行为;
  • 进行EMI/ESD评估并根据需要增加滤波与屏蔽措施。

总结:LM2575HVS-5.0/TR(基于以上参数)为一款面向高输入电压、低至中等功率等级的降压稳压解决方案,适合对成本与系统复杂度敏感但需要稳定 5V 输出的工业与嵌入式应用。合理的外部器件选择与良好的 PCB 布局是获得高效率、低纹波与长可靠寿命的关键。

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