WMSIC Electronic Components

HGSEMI AT24C02CN

ModelAT24C02CN
PackageDIP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI AT24C02CN
Type
HGSEMI
Minimum package
50 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
AT24C02CN
Electronic Component
1
Package
DIP-8
Electronic Component
EEPROM
Electronic Component
0.776g
Electronic Component
1
Features
Built-in positions(POR)
Electronic Component
BM0264336482
Electronic Component
2Kbit
Operating Temperature
40℃~+105℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Electronic Component
200
Clock Frequency(fc)
1MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT24C02CN 产品概述

一、概述

AT24C02CN(HGSEMI/华冠)是一款容量为2Kbit的串行EEPROM,采用标准I2C接口,适用于存储配置信息、校准数据、设备序列号和小容量非易失性参数。器件工作电压宽(1.7V ~ 5.5V),工作温度范围 -40℃ ~ +105℃,并提供长期数据保持与高写入寿命,适配工业级与便携式产品设计要求。

二、主要特性

  • 接口类型:I2C 串行总线(最高时钟频率 fc = 1MHz,兼容标准/快速/快速加模式)
  • 存储容量:2Kbit(256 × 8 或等效寻址方式)
  • 写周期时间:Tw ≈ 3ms(典型,写入后需等待内部写入完成)
  • 数据保持:TDR = 200 年(长期数据保持能力)
  • 写周期寿命:2,000,000 次(高耐久)
  • 安全与可靠性:内置上电复位(POR)、软件写保护与硬件写保护(WP 引脚)
  • 抗干扰:噪声抑制功能,提升在工业环境下的稳定性
  • 封装:DIP-8,便于插件与手工焊接/测试

三、电气参数与可靠性

器件支持宽电源电压范围(1.7V~5.5V),便于与各种MCU和电源域直接相连。高达1MHz的I2C时钟支持更快的数据读写需求。典型写入周期约3ms,推荐在写入操作后使用ACK轮询或等待写周期完成再进行下一次写操作。器件声称的数据保持可达200年,写入耐久高达200万次,适合需频繁更新配置或计数器的场景。

四、封装与引脚说明

AT24C02CN 提供标准DIP-8封装,便于插座化与样机调试。器件包含典型的I2C两线(SCL、SDA)、电源(VCC、GND)、硬件写保护(WP)与地址/控制引脚(视具体管脚定义而定)。硬件写保护引脚可在需要时上拉/下拉以实现物理保护;软件写保护通过EEPROM的控制字节或特定寄存位实现。

五、典型应用与设计建议

典型应用:工业控制、智能计量、传感器校准值存储、消费电子配置、物联网设备参数保存。设计建议:

  • 在VCC与GND之间并联 0.1μF 陶瓷去耦电容,靠近器件引脚放置;
  • I2C 总线使用合适的上拉电阻(典型 2.2kΩ–10kΩ,根据总线容量与速率调整);
  • 写操作后遵循 Tw(约3ms)或使用ACK轮询判断写完成;
  • 合理使用WP和软件写保护策略,关键参数建议同时启用硬件与软件保护;
  • 在有强干扰环境下,注意信号完整性与走线屏蔽,利用噪声抑制特性提升可靠性。

六、使用注意事项与故障排查

  • 避免在写周期内断电或频繁上电,这可能导致写入失败或数据损坏;
  • 若遇读写异常,先检查I2C上拉电阻、VCC电压、接地以及WP引脚状态;
  • 大批量应用中建议做寿命与温度应力验证,确保在目标环境下的数据保持与写入寿命满足需求;
  • DIP-8 封装便于开发测试,但量产时可考虑表面贴装封装以优化成本与可靠性。

总结:HGSEMI AT24C02CN 是一款面向工业与消费领域的高可靠性、低功耗2Kbit I2C EEPROM,凭借宽电源范围、长数据保持与高写入寿命,适合需要长期保存小容量关键数据的场合。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.