WMSIC Electronic Components

HGSEMI NE5532M/TR NE5532M

ModelNE5532M/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI NE5532M / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
NE5532M/TR
Electronic Component
1
Package
SOP-8
Electronic Component
Operational Amplifier
Electronic Component
0.224g
Electronic Component
1
Electronic Component
BM0227365047
Operating Temperature
0℃~+70℃
Amplifier
2
(SR)
11V/us
Electronic Component
Electronic Component
Electronic Component
2500
(GBW)
10MHz
Common Mode (CMRR)
100dB

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NE5532M/TR 产品概述

一、产品简介

NE5532M/TR 为华冠(HGSEMI)推出的双通道低噪声运算放大器,采用 SOP-8 封装,针对音频和精密放大场合设计。器件自 2023 年 SQ 批次起已更新为新版本,出货前建议客户做好样品验证以确认与既有系统的兼容性。

二、主要技术参数

  • 放大器数:双路
  • 共模抑制比(CMRR):100 dB
  • 噪声密度(eN):8 nV/√Hz @ 1 kHz
  • 输入失调电压(Vos):5 mV(典型/最大视规格)
  • 输入偏置电流(Ib):500 nA
  • 输入失调电流(Ios):5 nA
  • 增益带宽积(GBP):10 MHz
  • 压摆率(SR):11 V/µs
  • 最大供电电压(Vdd–Vss):44 V(双电源工作范围:-22 V ~ +22 V)
  • 工作温度:0 ℃ ~ +70 ℃
  • 封装:SOP-8
  • 品牌:HGSEMI(华冠)

三、性能特点

  • 低噪声设计(8 nV/√Hz),适合高保真音频前置放大及信号处理。
  • 较高的 CMRR(100 dB)在差分和共模信号环境中能有效抑制干扰。
  • 11 V/µs 的压摆率和 10 MHz 的 GBP 能满足多数音频滤波器、缓冲器和小信号放大器的动态要求。
  • 宽电源范围(最高 44 V)提高了系统设计灵活性,可支持较大供电幅度的应用。

四、典型应用

  • 专业音频前置放大器、混音台输入级、耳机放大器。
  • 有源模拟滤波器、仪表放大、精密信号处理。
  • 需低噪声和高共模抑制的差分放大场景。

五、样品测试建议与注意事项

由于器件在 2023 年 SQ 批次后已更新版本,建议客户在量产前进行下列样品测试:

  1. DC 项目:输入失调电压、输入偏置/失调电流、静态供电电流、输出偏移及漂移。
  2. 交流/动态:增益带宽、开环增益、压摆率、频率响应与相位裕度(稳定性)、负载驱动能力。
  3. 噪声与共模抑制:1 kHz 噪声密度测量、CMRR 在常用频段的验证。
  4. 供电容错:在-22 V~+22 V 及单电源极限(Vdd–Vss≈44 V)下功能鲁棒性测试。
  5. 环境与可靠性:温度循环、工作温度范围内性能一致性、以及封装焊接热循环兼容性。
  6. 与既有电路的兼容性:确认输入/输出摆幅、偏置点与频响不会引入振荡或失真。

六、封装与订购

  • 封装形式:SOP-8,便于表面贴装生产与替换旧款 8 引脚运放。
  • 订购与批次注意:请在采购时注明批次需求并索取最新版样品进行确认,尤其对已投产设计务必与供应端确认版本差异。

以上为 NE5532M/TR 的产品概述及测试建议。如需详细的典型电路、引脚图或完整电气特性表(电压电流极限、温漂系数等),可提供具体资料以便进一步跟进。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.