WMSIC Electronic Components

HGSEMI LT1764S/TR LT1764S

ModelLT1764S/TR
PackageTO-263-5
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LT1764S / TR
Type
HGSEMI
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
450mV@(3A)
Electronic Component
HGSEMI
Electronic Component
400uVrms
Electronic Component
LT1764S/TR
Electronic Component
1
Package
TO-263-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
2.304g
Electronic Component
1
Features
Current
Electronic Component
BM0227708179
Operating Temperature
40℃~+85℃@(Tj)
Operating Voltage
20V
Output
Electronic Component
Output Voltage
1.24V~15V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LT1764S/TR 产品概述

一、产品简介

LT1764S/TR 是华冠(HGSEMI)推出的一款高性能可调线性稳压器,采用 TO-263-5 封装,面向需要低噪声、低压差和高输出电流的电源应用场景。器件为正极输出、单通道设计,具备使能功能、过热保护与过流保护,可在-40℃到+85℃(Tj)范围内工作。典型应用包括模拟前端、基准电源、后级线性滤波以及对噪声敏感的系统供电。

二、主要电气参数

  • 输出类型:可调(可通过外部分压设置输出电压)
  • 输出电压范围:1.24V ~ 15V
  • 工作电压(输入最大):20V
  • 最大输出电流:3A
  • 压降(Dropout):450mV @ 3A
  • 输出极性:正极输出
  • 噪声:400 μVrms(典型)
  • 保护功能:使能(EN)、过热保护、过流保护
  • 工作温度范围:-40℃ ~ +85℃(Tj)
  • 封装:TO-263-5(便于大功率散热的贴片封装)
  • 通道数:1

三、功能亮点

  • 低压差:在满载 3A 时压差仅约 450mV,适合输入电压与输出电压接近的场合,能够减少功耗并提高效率。
  • 低噪声输出:典型噪声 400 μVrms,适用于 ADC、DAC、放大器等对电源噪声敏感的电路。
  • 可调输出:通过外部电阻分压可在 1.24V 到 15V 范围内灵活设定输出电压,适配多种电源需求。
  • 保护齐全:内置热关断与限流保护,可在异常工况下保护器件与负载。
  • 使能控制:使能脚可用于软件或系统级电源管理,实现上电/关断控制与省电策略。

四、典型应用场景

  • 开关电源后的线性后级(post-regulator)以进一步降低开关噪声
  • 精密模拟电路与传感器供电(低噪声要求)
  • 通信、射频前端的局部稳压电源
  • 工业控制与测试设备中对稳定性与瞬态响应有要求的电源模块
  • 电源管理模块与分支稳压器

五、使用建议与设计要点

  • 输出电容:为了保证环路稳定性与最佳瞬态响应,建议在输出端使用低等效串联电阻(ESR)的电容,例如固态铝电解、电解陶瓷或钽电容。常规设计会在 10 μF ~ 100 μF 范围选择合适容量,具体值应参考电路实际负载与回路相位裕度。
  • 输入去耦:在靠近器件输入端放置 0.1 μF 陶瓷去耦电容,并并联较大容值的输入电容以抑制输入源阻抗引起的振荡。
  • 调节脚旁路:在调节(ADJ)引脚并联一个小电容可以显著降低输出噪声并改善瞬态性能,常见取值从几十纳法到微法级,具体取值请根据噪声与稳定性要求调整。
  • 热设计:线性稳压器的功耗 Pd = (Vin - Vout) × Iout,器件需要通过 PCB 大面积铜箔或额外散热措施来散热。TO-263-5 封装利于通过底部焊盘和大面积铜箔散热,但在高 Vin 与大电流工况下仍需做热仿真与功率限制。
  • 版图布局:输入、输出和接地走线应尽量短且宽,输入电容与输出电容靠近相应引脚放置,接地采用完整平面或短回路以降低噪声耦合。
  • 使能控制:使能引脚可实现软关断与系统电源管理,具体门限电平与使能逻辑请参阅器件手册并与所用 MCU/逻辑电平匹配。

六、封装与采购信息

  • 品牌:HGSEMI(华冠)
  • 型号:LT1764S/TR
  • 封装:TO-263-5(D2PAK 类似,适合表面贴装与较大功率散热)
  • 订购与替代:采购时请关注批号、封装与测试条件一致性;如需更高温度等级或其它封装,可在选型时比对同类 LDO 的规格差异。

七、总结

LT1764S/TR 是一款面向中高功率、低噪声场合的可调线性稳压器,3A 的输出能力、450mV 的低压差及完整的保护功能,使其在模拟与工业电源设计中具有较高的适用性。合理的热设计、稳压器输入/输出电容与 PCB 布局是发挥其性能的关键。对于需要低噪声、高精度局部稳压的应用,LT1764S/TR 是值得优先考虑的方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.