Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HGSEMI LM2576S-5.0/TR LM2576S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HGSEMI LM2576S-5.0 / TR
- Type
- HGSEMI
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HGSEMI
- Electronic Component
- LM2576S-5.0/TR
- Electronic Component
- 1
- Package
- TO-263-5
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 2.8g
- Electronic Component
- 1
- Type
- Electronic Component
- Electronic Component
- BM0223218423
- Operating Temperature
- 40℃~+125℃@(TJ)
- Operating Voltage
- 40V
- Switching Frequency
- 52kHz
- Electronic Component
- Electronic Component
- Output Voltage
- 5V
- Output Current
- 3A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LM2576S-5.0/TR 产品概述
一、产品简介
LM2576S-5.0/TR 是一款高效、低成本的降压型 DC-DC 转换器芯片，采用 TO-263-5L 封装，专为各种应用设计，如电源管理、便携设备、电子仪器和工业控制等。该芯片基于 HGSEMI（华冠）技术，能够将输入电压稳定地降到5V，具备高度的集成性和出色的性能，是开发者和电子工程师在设计电源解决方案时的理想选择。
二、技术特点
高转换效率：LM2576S-5.0/TR 的转换效率可达到 75% 至 90% 以上，能够有效降低系统热损耗，提高整体系统性能。
宽输入电压范围：该芯片支持广泛的输入电压范围，通常为 7V 至 40V，便于在多个电源环境下使用。
负载能力：LM2576S-5.0/TR 支持高达 3A 的负载电流，能够满足大多数中小功率电源应用的需求。
内置保护功能：集成短路保护、过载保护及过热保护功能，确保电路在异常情况下的安全工作，并延长使用寿命。
简化的电路设计：由于其内置补偿网络和简单的外部元件需求，LM2576S-5.0/TR 可以轻松集成进多种电源设计中，减少设计时间。
开关频率：工作频率通常为 52kHz，提供良好的电流转换性能，同时降低外部元件尺寸。
三、封装和应用
LM2576S-5.0/TR 采用 TO-263-5L 封装，具有良好的散热性能和便于焊接的特点，非常适合高密度电子设备的应用。其外形结构在热传导上也表现出色，确保了芯片在高负载下的可靠运行，适用于如下场景：
- 汽车电子：如车载充电器、仪表盘电源等。
- 工业控制：如可编程控制器（PLC）、传感器供电等。
- 消费电子：如移动设备、音响系统等。
- LED驱动：适合于大功率 LED 照明设备的供电方案。
四、应用电路示例
在应用 LM2576S-5.0/TR 时，开发者可考虑使用简单的输入和输出滤波器，以帮助抑制电源波动和噪声，确保输出电压的稳定性。此外，外部电感和电容的选择应基于具体的应用需求，确保电路在不同负载下都有良好的工作特性。
五、总结
作为一款经济高效的 DC-DC 降压转换器，LM2576S-5.0/TR 通过其出色的性能和简易的电路设计，为电子工程师提供了极大的便利，尤其是在需要将高电压转换为更低电压的场合。无论是用于新产品开发，还是现有产品升级，LM2576S-5.0/TR 都是一个值得考虑的优秀选择。其丰富的应用场景和高可靠性表现，使其成为市场上极具竞争力的解决方案之一。
对于任何需要稳定、可靠电源的行业，LM2576S-5.0/TR 提供了一个安全、灵活的实现途径。无论是在工业、消费电子，还是在汽车电子领域，这款芯片都能为技术创新提供强有力的支持，推动进一步的产品发展。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
