WMSIC Electronic Components

HGSEMI DS1302ZM/TR DS1302ZM

ModelDS1302ZM/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI DS1302ZM / TR
Type
HGSEMI
Minimum package
2500 卷

Technical parameters

Electronic Component
HGSEMI
Electronic Component
DS1302ZM/TR
Electronic Component
1
Package
SOP-8
Electronic Component
Real-Time Clock (RTC)
Electronic Component
0.245g
Electronic Component
1
Features
Power Management and Battery; SRAM / NVRAM
Electronic Component
BM0224581989
Operating Temperature
40℃~+85℃
Operating Voltage
2V~5.5V
Interface Type
Interface
Crystal Oscillator Type
Electronic Component
Output
Electronic Component
Static Current(Iq)
100nA
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:DS1302ZM/TR

一、引言

在现代电子产品中,实时钟(RTC)芯片是至关重要的组成部分,广泛应用于各种设备,如微控制器、数据记录器、仪器仪表等,以提供准确的时间和日期信息。DS1302ZM/TR是HGSEMI(华冠)推出的一款工业级、低功耗的实时时钟芯片,具有涓细电流充电能力,非常适合于要求高精度时间追踪和低功耗的应用场景。

二、产品特点

  1. 低功耗设计:DS1302ZM/TR在典型工作模式下功耗极低,适合于电池供电的设备。低功耗特性延长了电池的使用寿命,满足一些长时间待机的应用需求。

  2. 涓细电流充电能力:该芯片支持涓细电流充电,允许在极低电流下维持其时钟功能。在电源断开的情况下,仍能通过外部电池或电容维持时钟的准确性,确保重要数据的安全性。

  3. 多种工作模式:DS1302ZM/TR具备多种操作模式,支持待机和活动模式切换,可以根据不同的应用需求灵活调整。

  4. 高精度时钟:该芯片能够可靠地提供实时时间,精度高,误差小,适合于对时间要求严格的行业应用。

  5. 简单的接口:采用SOP-8封装形式,DS1302ZM/TR提供简便的引脚排列和操作方式,便于电路设计和PCB布局。

  6. 易于集成:该芯片可以与多种微控制器和单片机轻松集成,支持I2C/SPI等多种通信协议,方便设计人员进行接入。

三、适用场景

DS1302ZM/TR的出色性能使其适合于多个应用领域,例如:

  1. 消费电子:在智能手表、家居自动化设备以及各类电子产品中,提供准确的时间和日期,确保设备按时执行任务。

  2. 工业控制:在工业自动化设备及仪器仪表中,该芯片可用于时间戳记录、故障分析等功能,提高设备管理和故障排查的效率。

  3. 医疗设备:对于医疗监测和记录设备,保证时间的准确性是非常重要的,DS1302ZM/TR可用于药品管理和患者状态监测。

  4. 数据记录器:在数据采集系统中,时间戳对于数据的可靠性至关重要,而该芯片能以低功耗的方式有效地记录时间。

  5. 通信设备:在从事数据传输和通信的设备中,准确的时间戳有助于数据的同步和整合,提高通信质量。

四、性能参数

  • 电源电压:适用的电源电压范围通常在2.0V至5.5V之间,可根据设定的需求进行选型。
  • 温度范围:工作温度范围可达-40°C至+85°C,适合各种严苛环境下的应用。
  • 数据保持能力:在断电状态下,依然能通过外部备份电源保持数据存储,使其非常适合于重要信息的长时间保存。

五、总结

DS1302ZM/TR作为一款工业级的低功耗实时时钟芯片,以其卓越的性能、出色的充电能力与广泛的应用场景而成为设计师们的理想选择。无论是在消费电子、工业控制还是医疗设备等领域,DS1302ZM/TR都能够提供稳定而准确的时间服务,极大地推动产品的发展与创新。其便捷的接口与高集成度使得设计更为灵活,是电子工程师在开发低功耗设计时的首选元器件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.