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HGSEMI TJA1050M/TR TJA1050M
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HGSEMI TJA1050M / TR
- Type
- HGSEMI
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HGSEMI
- Electronic Component
- TJA1050M/TR
- Electronic Component
- 1
- Package
- SOP-8
- Type
- CAN Transceiver
- Electronic Component
- CAN Transceiver
- Electronic Component
- 0.236g
- Electronic Component
- 1
- Channel Count
- 1
- Features
- ESD; TXD; Low Power; Bus
- Electronic Component
- BM0257664141
- Operating Temperature
- 40℃~+150℃
- Operating Voltage
- 4.75V~5.25V
- Operating Current
- 70mA
- Data
- 1Mbps
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TJA1050M/TR 产品概述
一、产品简介
TJA1050M/TR 是华冠（HGSEMI）推出的一款高性能 CAN 总线收发器，面向要求高速、抗干扰与高温工作的工业与汽车电子场景。器件支持最高 1 Mbps 的数据传输速率，采用标准 5V 供电（4.75V～5.25V），并以 SOP-8 封装提供便于线路板组装的封装形态。
二、主要性能参数
- 类型：CAN 收发器（高/高速）
- 数据速率：最高 1 Mbps
- 工作电压：4.75V ～ 5.25V（典型系统 5V）
- 工作电流：典型 70 mA（总线活动状态）
- 静态/待机电流：典型 15 μA（低功耗待机）
- 工作温度范围：-40℃ ～ +150℃（适应严苛环境）
- 封装类型：SOP-8
这些参数使其在瞬态响应、总线冲突处理和低功耗休眠方面具有良好平衡。
三、典型应用场景
- 汽车车身控制与车载网络（门控模块、仪表盘、智能传感器）
- 工业控制系统与现场总线接口（PLC、驱动器通信）
- 电力电子与能源管理系统中的控制通信节点
- 医疗设备与楼宇自动化中要求高可靠性的串行网络连接
四、封装与机械特性概览
SOP-8 封装利于自动贴装与回流焊工艺，适配常见 PCB 布局。封装尺寸及引脚排列建议参照器件数据手册以保证电气与热散布设计符合规范。
五、使用与设计建议
- 电源去耦：VCC 旁并联 0.1 μF 与 1 μF 陶瓷电容，靠近引脚布置以抑制瞬态电流。
- 总线终端：在总线两端配置 120 Ω 终端电阻，必要时并联偏置电阻或故障侦测电路。
- ESD 与浪涌保护：在 CAN_H/CAN_L 总线上增加 TVS 二极管以提高系统抗干扰能力。
- 散热与布局：工作电流较高时注意 PCB 散热路径，避免长期高温运行导致性能下降。
六、可靠性与环境适应
- 宽温特性（-40℃ 至 +150℃）适合车规级与高温工业场合，但实际可靠性应结合焊接工艺与系统散热评估。
- 循环老化与温度冲击试验建议参照应用领域的标准（如 AEC-Q100 等）进行验证。
结语：TJA1050M/TR 以其 1 Mbps 的高速能力、低待机功耗和宽温范围，适合对通信可靠性与环境适应性有较高要求的应用。在设计时请结合数据手册对引脚、时序及电气特性进行详细核对，以确保在目标系统中的长期稳定运行。
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