WMSIC Electronic Components

HGSEMI CD40106BM/TR CD40106BM

ModelCD40106BM/TR
PackageSOIC-14
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI CD40106BM / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
CD40106BM/TR
Electronic Component
1
Package
SOIC-14
Electronic Component
Buffers / Drivers / Transceivers
Electronic Component
4000B
Electronic Component
0.304g
Electronic Component
6
Electronic Component
1
Electronic Component
BM0227715625
Operating Temperature
40℃~+85℃
Operating Voltage
5V~15V
Type
Flip-Flop
Type
Electronic Component
Current(IOH)
3.4mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CD40106BM/TR 产品概述

一、产品简介

CD40106BM/TR 是华冠(HGSEMI)推出的一款基于4000B系列工艺的六路施密特触发器缓冲/驱动器。器件在 5V 至 15V 的宽电源电压范围内稳定工作,单片包含 6 个独立的施密特触发输入/反相输出单元,适合信号整形、去抖动、缓冲驱动与电平恢复等应用场景。器件采用 SOIC-14 封装,提供卷带盘装(TR)便于贴片生产。

二、主要规格与特点

  • 输入类型:施密特触发器(schmitt trigger),具有明显的迟滞特性,抗噪声能力强,适合慢沿或毛刺抑制。
  • 工作电压:5V ~ 15V(宽电压范围,兼容多种系统电源)。
  • 元件数:6 个独立通道(六路)。
  • 输出驱动能力:拉电流 IOH = 3.4 mA,灌电流 IOL = 3.4 mA(典型负载驱动能力,适合驱动逻辑门或小功率指示器)。
  • 静态电流:Iq ≈ 1 μA(典型,低静态功耗,适合低功耗系统)。
  • 工作温度范围:-40 ℃ ~ +85 ℃(工业级温度范围)。
  • 系列:4000B 系列 CMOS 器件,具有高输入阻抗、低功耗特点。
  • 封装形式:SOIC-14(表面贴装,适配现代 SMT 生产流程)。

三、典型应用场景

  • 开关按键去抖与输入整形:施密特触发可将缓慢或带毛刺的输入转换成干净的数字波形。
  • 信号缓冲与电平转换(低速):在相同电压域内为后级电路提供稳定驱动。
  • 振荡器与脉冲整形电路:与 RC 网络配合可实现单稳/多谐振荡功能。
  • 低功耗监控与唤醒电路:低静态电流有利于电池供电系统。
  • LED 指示(小电流)、光电耦合器驱动(小负载)等。

四、设计与使用建议

  • 电源去耦:建议在 VCC 与 GND 之间放置 0.01 μF~0.1 μF 陶瓷旁路电容,减小电源噪声与瞬态影响。
  • 输入处理:CMOS 输入不可悬空,悬空输入可能导致不稳定或增加静态电流。对开关输入应并联上拉/下拉电阻以确定初始状态。
  • 负载能力:器件输出驱动能力为 3.4 mA,适合驱动高输入阻抗逻辑或小电流指示器;若需驱动大电流负载(如强光 LED、继电器等),请增加外部驱动器或功率场效应管/晶体管。
  • 温度与电压保护:避免在超出规定电压/温度范围下使用,以免损坏器件或引起性能漂移。
  • 布局与接地:SOIC-14 封装建议紧凑布局,短接地回流路径以减少噪声耦合。

五、封装与采购信息

  • 型号说明:CD40106BM/TR,末尾 TR 表示卷带盘(Tape & Reel)包装,便于自动化贴片生产。
  • 封装:SOIC-14(节省 PCB 面积,适用于表面贴装工艺)。
  • 质量与可靠性:满足工业级温度要求,适用于一般工业与商业电子产品应用。

本器件以其施密特输入的抗噪声特性、低静态功耗和宽电源电压范围,适合在需要信号整形与低功耗缓冲驱动的场合使用。在设计时注意输入不要悬空、做好电源去耦和根据负载选择合适的外部驱动方案,即可获得稳定可靠的系统性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.