WMSIC Electronic Components

HGSEMI DS1307ZM/TR DS1307ZM

ModelDS1307ZM/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI DS1307ZM / TR
Type
SOP-8
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
DS1307ZM/TR
Electronic Component
1
Package
SOP-8
Electronic Component
Real-Time Clock (RTC)
Electronic Component
0.077g
Electronic Component
1
Features
Power Management and Battery; SRAM / NVRAM; Programmable Clock Output
Electronic Component
BM0227365043
Operating Temperature
40℃~+85℃
Operating Voltage
4.5V~5.5V
Operating Current
1.5mA
Interface Type
I2C
Crystal Oscillator Type
Electronic Component
Output
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DS1307ZM/TR 产品概述

一、产品简介

DS1307ZM/TR(华冠 HGSEMI 代理)是一款工业级实时时钟芯片,采用 SOP-8 封装,适用于对时间持续性和环境适应性要求较高的嵌入式系统。芯片通过标准 I2C 总线与主控器件通信,工作电压范围为 4.5V~5.5V,典型工作电流约 1.5mA,工作温度范围为 -40℃~+85℃,满足工业级应用场景的可靠性需求。芯片需配合外置 32.768kHz 晶振使用,不带独立闹钟输出(无闹钟引脚)。

二、核心参数一览

  • 接口类型:I2C(双线接口,SDA/SCL)
  • 工作电压:4.5V ~ 5.5V(5V 主供电)
  • 工作电流:约 1.5mA(典型)
  • 晶振:外置 32.768kHz 晶体(晶振对接脚)
  • 闹钟输出:无独立闹钟输出
  • 工作温度:-40℃ ~ +85℃(工业级)
  • 封装:SOP-8
  • 品牌:HGSEMI(华冠)

三、主要功能与特点

  • 精确的实时时钟/日历功能,支持秒、分、时、日、月、年(含闰年)等计时寄存器,便于系统按日历时间调度与记录。
  • 通过 I2C 总线进行寄存器读写,支持标准两线协议,便于与各种微控制器连接。
  • 外置 32.768kHz 晶振驱动,便于更换与调校,利于长期稳定运行。
  • 支持备用电池供电(VBAT),在主电源断电时保持走时与必要数据(请在设计中考虑电池管理方案)。
  • 工业级温度与电压范围,适合工业自动化、通信设备和仪器仪表等严苛环境。

四、应用场景

  • 工业自动化与控制系统:设备运行日志、事件时间戳记录。
  • 数据采集与记录(数据记录仪、计量设备):保证断电后时间连续性。
  • 通信与网络设备:系统启动时间与定时任务调度。
  • POS、售货机、门禁与安防设备:事务记录与时间校验。
  • 各类嵌入式系统:需要可靠时钟与日历功能的场合。

五、设计与使用注意事项

  • 晶振选型:推荐使用 32.768kHz 专用晶体,并将晶体靠近芯片晶振引脚布局,减少干扰。
  • 电源管理:在 VCC 与 VBAT 之间设计合适的电源切换或隔离方案,确保备用电池只在主电源断电时供电,以延长电池寿命。
  • I2C 总线:为 SDA/SCL 添加上拉电阻,注意总线电平与主控电压兼容(芯片工作在 5V 区间时与 3.3V 主控接口需采取电平兼容措施)。
  • 去耦与布线:在 VCC 与 GND 端添加去耦电容,晶振旁保持安静布线,避免高频干扰影响走时精度。
  • 温度与可靠性:用于高低温或强振动场合时,应进行相应的可靠性验证与老化测试。

六、选型与采购建议

  • 采购时确认封装(SOP-8)、标识和物料编码(TR 为卷带包装),并向供应商索取技术资料与原厂测试报告。
  • 若系统对时间精度有更高要求,可评估含温度补偿及内部晶振源的高精度 RTC 作为替代(如需外部校准功能的型号)。
  • 关注库存与替代件策略,工业类元件建议建立可替代型号清单以降低后续维护风险。

如需基于 DS1307ZM/TR 的引脚分配、典型接线图或针对特定应用的参考电路,我可进一步提供详图与设计建议。

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