WMSIC Electronic Components

HGSEMI LM2596HVS-ADJ/TR LM2596HVS

ModelLM2596HVS-ADJ/TR
PackageTO-263-5
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 71401

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM2596HVS-ADJ / TR
Type
HGSEMI
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM2596HVS-ADJ/TR
Electronic Component
1
Package
TO-263-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
2.352g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227708181
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
60V
Switching Frequency
150kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM2596HVS-ADJ/TR 产品概述

一、概述

LM2596HVS-ADJ/TR 为降压型(Buck)开关稳压器,适用于输入电压范围宽、输出电流要求高的直流-直流电源转换场合。该器件由华冠(HGSEMI)生产,封装为 TO-263-5,内置功率开关管,非同步整流结构,最大输出电流可达 3A,开关频率约 150kHz,静态工作电流约 5mA,工作结温范围 -40℃ 至 +125℃(TJ)。器件提供可调输出,内部参考电压典型值位于 1.193V1.267V 区间,用于外部反馈设定目标输出电压(1.2V37V 可调)。

二、主要特性

  • 输入电压范围:4.5V ~ 60V,适应汽车、电动工具、工业电源等高压输入场景。
  • 输出电压范围:可调 1.2V ~ 37V,通过外部电阻分压器设置。
  • 输出电流:最大 3A(要求良好散热与合适的外部器件配置)。
  • 开关频率:约 150kHz,兼顾效率与外部元件体积。
  • 非同步整流:需外接肖特基二极管以降低整流损耗。
  • 静态电流(Iq):约 5mA,适合中高功率应用但非超低功耗场景。
  • 保护功能:内部限流、热关断及软启动(视版本实现),提高系统可靠性。
  • 封装:TO-263-5,便于散热设计与大电流处理。

三、典型应用场景

  • 汽车电子(车载电源降压)
  • 工业控制与通信设备电源
  • 电池供电系统与电源管理模块
  • 点亮LED驱动与便携设备供电

四、外部器件与典型电路要点

LM2596HVS-ADJ 为非同步降压器,典型电路需外接:

  • 高品质肖特基整流二极管(耐压与电流余量需满足输出条件);
  • 合适电感(依据输出电流与允许电流纹波选择,150kHz 允许体积适中);
  • 输入/输出低 ESR 电容(抑制电压尖峰与纹波);
  • 输出反馈电阻分压,依据内部参考计算 Vout = Vref × (1 + R2/R1);
  • 在高输入电压或高功耗场合,注意功率器件的散热与封装导热路径。

五、热管理与布局建议

  • TO-263-5 封装需要良好 PCB 散热面与足够铜箔面积(尤其接地与散热焊盘);
  • 高频开关回路应尽量缩短回流路径,输入电容靠近器件 VIN 与 GND 引脚;
  • 输出二极管、功率电感与器件之间合理间距,避免热叠加;
  • 在高温或高功率工况下应评估热升并采取散热片或加强铜时效。

六、选型与注意事项

  • 若系统要求更高效率与更小电感/二极管损耗,可考虑同步整流降压器替代;
  • 输入电压接近上限(60V)时,元件耐压裕度、抑制尖峰的吸收电路与布局尤为重要;
  • 实际输出电流 3A 需配合合适外部器件与散热方案,避免长期过热导致可靠性下降。

本产品适合对输入电压范围、输出电流有较高要求的降压电源设计,在保证合理布局与散热条件下,可提供稳定的可调输出与良好的系统可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.