WMSIC Electronic Components

HGSEMI LM1117T-3.3 LM1117T

ModelLM1117T-3.3
PackageTO-220-3L
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 71404

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM1117T-3.3
Type
HGSEMI
Minimum package
1000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
1.25V@(1A)
Electronic Component
HGSEMI
Electronic Component
0.003%Vout
Electronic Component
LM1117T-3.3
Electronic Component
1
Package
TO-220-3L
Electronic Component
Linear Regulator(LDO)
Electronic Component
2.719g
Electronic Component
1
Electronic Component
BM0226047405
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
15V
Output
Electronic Component
Output Voltage
3.3V
Output Current
1A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM1117T-3.3(HGSEMI 华冠)产品概述

一、产品简介

LM1117T-3.3 是一款单路固定输出的低压差线性稳压器(LDO),由 HGSEMI(华冠)生产,封装为 TO-220-3L。该器件输出为正极 3.3V,最大输出电流可达 1A,适用于对低噪声、电源稳定性有较高要求的嵌入式与工业应用。

二、主要特性

  • 输出电压:3.3V(固定)
  • 输出电流:最大 1A
  • 压差(Dropout):1.25V @ 1A
  • 工作电压(输入允许):最高 15V
  • 静态电流(Iq):10mA(典型)
  • 电源纹波抑制比(PSRR):75dB @ 120Hz
  • 输出噪声:0.003% Vout(约 99µV RMS 量级)
  • 保护机制:过流保护(OCP)、过热保护(thermal shutdown)
  • 工作结温:-40℃ ~ +125℃ (Tj)
  • 封装:TO-220-3L(散热良好,便于加装散热片)

三、性能说明与设计注意

  • 稳定性与电容:为保证稳定与良好瞬态响应,建议在输入端和输出端分别并联 10µF(或等效低 ESR)电容,输出端电容应靠近引脚布置。
  • 散热与功耗:在 Vin = 15V、Iout = 1A 条件下,器件耗散约 (15 − 3.3)×1A ≈ 11.7W,须采用合适散热片或良好 PCB 散热设计以避免热关断或过热损伤。
  • 引脚与接线:TO-220-3L 常见的引脚排列为(从左到右)ADJ/GND(固定版为 GND)、OUT、IN,金属背板通常与 IN 相连,具体以产品数据手册为准。
  • 可靠保护:内部过流与过热保护在短路或过载时能提供自恢复保护,但长期工作在极限条件下会降低可靠性,建议电路中增加外部限流或熔断措施。

四、典型应用场景

  • 嵌入式系统与单板电脑的 3.3V 电源供给
  • 工业控制器、传感器供电模块
  • 通信设备、外围接口电源
  • 需要高 PSRR、低噪声的模拟前端与 ADC 供电

五、总结

LM1117T-3.3(HGSEMI)以其高 PSRR、低噪声与内置保护特性,适合为要求稳定 3.3V 电源的小型至中等功率系统提供可靠供电。设计时应重视输出电容的选择和完善的散热处理,确保在高 Vin 与大电流条件下稳定、安全运行。若需进一步的电气特性曲线、热阻参数或典型应用电路图,请参照官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.