WMSIC Electronic Components

HGSEMI CD4013BE

ModelCD4013BE
PackageDIP-14
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 71405

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI CD4013BE
Type
HGSEMI
Minimum package
1000 盒

Technical parameters

Electronic Component
positionsand positions
Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
CD4013BE
Electronic Component
1
Package
DIP-14
Type
D
Electronic Component
Flip-Flop
Electronic Component
4000B
Electronic Component
1.613g
Electronic Component
2
Electronic Component
Electronic Component
Electronic Component
1
Latching
2ns;2ns;2ns
Electronic Component
BM0227715632
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CD4013BE 双D触发器(HGSEMI / 华冠)产品概述

一、产品简介

CD4013BE 是一款来自 HGSEMI(华冠)的双独立 D 型触发器芯片,封装形式为 DIP-14。每个触发器均为上升沿触发、带独立异步置位(SET)与复位(RESET)输入的 1 位存储单元,属于经典的 4000B 系列 CMOS 器件。器件在宽电源电压范围内工作,静态功耗低,适合低功耗和中速数字电路设计。

二、主要特性

  • 类型:D 型(上升沿触发),双通道(2 个独立触发器)
  • 异步置位/复位:独立的 SET 与 RESET,引脚为异步控制(任意时刻可影响输出)
  • 电源电压范围:5 V ~ 15 V(宽电压范围,兼容各种系统)
  • 最大时钟频率(典型):约 24 MHz(实际最高取决于电压、负载与温度)
  • 静态电流(Iq):典型 20 nA(非常低的静态耗电,适合电池供电应用)
  • 输入电容:典型 5 pF(输入负载轻,利于高速信号驱动)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:DIP-14,便于面包板/插座使用与手工焊接

三、电气性能与时序(典型/参考)

以下参数均为典型条件下给出,测量负载为 50 pF,工作温度与具体测试条件会影响最终数值,应用时请参考完整数据手册以获得严格保证值。

  • 传播延迟 tpd(CLK 上升沿到 Q 输出):

    • 150 ns @ 5 V, 50 pF
    • 65 ns @ 10 V, 50 pF
    • 45 ns @ 15 V, 50 pF
  • 建立时间(setup time)与保持时间(hold time):

    • 建立时间(典型):10 ns / 20 ns / 7 ns(随工作电压与负载变化,请以具体工作点为准)
    • 保持时间(典型):2 ns(不同电压下大体一致)
  • 驱动能力(输出电流):

    • 下拉电流 IOL(典型):6.8 mA / 2.6 mA / 1 mA(对应不同电源电压)
    • 上拉电流 IOH(典型):2.6 mA / 1 mA / 6.8 mA(对应不同电源电压)
      注:上述多个数值随电源电压顺序给出(5 V、10 V、15 V);具体驱动能力应根据系统负载和工作电压选型核实。
  • 时钟频率:在无过大负载且电源在较高电压时,器件可支持较高时钟速率(典型值约 24 MHz);负载电容增大或电源下降会显著降低可用工作频率。

四、功能说明与使用要点

  • 工作方式:每个触发器在时钟上升沿采样 D 输入并将其送至 Q 输出;当 SET 置为有效时 Q 被强制置位;当 RESET 置为有效时 Q 被强制复位。应避免 SET 与 RESET 同时置为有效,以防输出不确定。
  • 异步控制:SET/RESET 为异步输入,可在任意时间改变输出状态,不受时钟边沿限制;因此在时序设计时需格外注意其对数据完整性的影响。
  • 引脚与封装:DIP-14 方便原型验证与替换,适合板级测试与教学应用。

五、典型应用场景

  • 数据采样、寄存器或单比特存储单元
  • 分频器与脉冲整形电路
  • 简易状态机的状态寄存器
  • 计数器的触发级、开关去抖(配合适当时序)
  • 低功耗逻辑要求的嵌入式与便携设备

六、设计建议与注意事项

  • 电源旁路:在 VDD 与 VSS 之间放置 0.1 μF 陶瓷旁路电容,靠近器件引脚,以抑制瞬态噪声并提升时序稳定性。
  • 未使用输入:所有未使用的输入应避免浮空,建议拉至高或低电平(通过直接接 VDD/VSS 或上拉/下拉电阻),以防止功耗上升或输出抖动。
  • 时序裕量:在高频或临界时序应用中,应留有充分的建立/保持裕量,并考虑传播延迟随温度和电压的变化。
  • 输出负载与驱动:根据 IOL/IOH 给出的驱动能力估算负载能力,避免超出输出电流限制;更大负载建议使用缓冲器或推挽放大器。
  • 异步控制使用:慎用异步置位/复位于时钟敏感路径,若需在时钟周期中改变状态,尽量保证在安全时窗或在已知时序下操作。

七、总结

CD4013BE(HGSEMI 华冠)是性能稳定、适用性广的双 D 触发器器件,凭借宽电源范围、极低静态电流和方便的 DIP 封装,非常适合中低频数字电路、原型开发与低功耗设计。基于给定的传播延迟、建立/保持时间与驱动能力参数,在系统级设计时应综合考虑电源电压、负载电容与时序裕量,确保可靠工作。对于精确时序与高速需求场景,建议在目标工作点下进行实际测量并参考完整数据手册以获得保证参数。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.