Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HRE CSA0402X5R105K6R3GT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0402X5R105K6R3GT
- Type
- 0402
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0402X5R105K6R3GT
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0264743623
- Electronic Component
- X5R
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0402X5R105K6R3GT 产品概述
一、产品简介
CSA0402X5R105K6R3GT（品牌：HRE/芯声）是一款表面贴装多层陶瓷电容（MLCC），封装尺寸为0402（公制1005）。额定电压6.3V，标称电容1.0µF，初始容差±10%（K），介质类型为X5R，适用于对体积和封装高度有严格要求的移动设备、便携电子与高密度电路板设计。
二、主要规格
- 封装：0402（1005）表面贴装
- 标称电容：1.0 µF
- 容差：±10%（K）
- 额定电压：6.3 V DC
- 介质：X5R（工作温度范围典型为 −55°C 至 +85°C，按IEC标准温度变化范围内电容变化一般在 ±15%）
- 极性：无极性（非极性）
- 包装方式：卷带（Tape & Reel），适配自动贴片生产线
三、产品特点与优势
- 小尺寸、高密度：0402 封装可显著节省 PCB 面积，适合空间受限应用。
- 中性介质性能：X5R 在中温范围内提供较高的容值密度与较好的介稳性，适合去耦、旁路与储能用途。
- 工艺兼容：适用于现行无铅回流工艺（遵循厂方回流曲线与 J-STD-020 要求），可靠性高。
- 低等效串联阻抗（相对同类陶瓷款式），响应速度快，适合电源旁路与滤波。
四、建议使用与工艺注意
- 直流偏置效应：X5R 型 MLCC 在实际工作电压下会出现 DC bias 导致实际有效电容下降，关键设计场合请参考厂方 DC-bias 曲线并适当留有裕量或降额使用。
- 降额建议：在高温或关键电源路径中，可考虑电压降额以提升长期可靠性。
- 焊接工艺：建议遵循制造商回流焊工艺曲线与 J-STD-020；典型无铅回流峰值温度在 245–260°C 范围内，避免过度热冲击与反复回流。
- PCB 焊盘与贴片：采用对称焊盘、合理焊膏量可降低“翘头”（tombstone）风险；0402 尺寸对贴片精度与焊膏印刷控制要求较高。
五、典型应用场景
- 手机、平板与可穿戴设备的电源去耦与局部储能
- 通信设备、蓝牙/无线模块的滤波与稳压回路
- 工业与汽车电子中的信号旁路（需评估工作温度与可靠性要求）
- 高密度 PCB 及空间受限的消费电子产品
六、可靠性与合规
- 符合 RoHS 等环保要求（请以出货检验证书为准）。
- 在满足厂方推荐的焊接与使用条件下，具有良好的机械与热循环可靠性。需要更严格的环境耐受（如汽车 AEC-Q）或特殊认证时，请与供应商确认具体型号与验证报告。
如需厂方直流偏置曲线、回流焊工艺曲线、封装尺寸图或样片/批量供货信息，可提供后续对接帮助。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
