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HRE CGA0402X7R332K500GT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0402X7R332K500GT
- Type
- 0402
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0402X7R332K500GT
- Electronic Component
- 1
- Electronic Component
- 3.3nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.013g
- Electronic Component
- 10
- Electronic Component
- BM0264778620
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0402X7R332K500GT 产品概述
一、产品简介
CGA0402X7R332K500GT 为 HRE（芯声）系列贴片多层陶瓷电容（MLCC），标称容值 3.3nF，容差 ±10%（K），额定直流电压 50V，介质温度系数 X7R，标准封装 0402（约 1.0 × 0.5 mm）。适合高密度表面贴装电路中的去耦、旁路、滤波与时序回路等通用场景。
二、主要特性
- 容值：3.3 nF ±10%
- 额定电压：50 V DC
- 介质：X7R（-55℃～+125℃ 范围内电容变化 ≤ ±15%）
- 封装：0402（超小型，适合高密度布局）
- 低 ESR / 低 ESL，适合高频去耦与旁路应用
- 表面贴装，适配自动化回流焊装配
三、电气与温度行为
X7R 属于二类陶瓷，具有中等温度稳定性，但存在典型特性：
- 温度依赖：在规定温区内电容变化受限（≤±15%），适合宽温工作环境。
- 电压依赖（DC bias）：在接近额定电压或高电压条件下电容值会发生明显下降，尤其是小尺寸与较大介电常数材料组合时更为显著。设计时需按实际工作电压预留裕量。
- 老化与长期漂移：类钛酸铋陶瓷会有随时间的缓慢衰减，应在长期稳定性要求高的场合核实数据表并预留余量。
四、封装与贴装建议
- 0402 封装尺寸小，推荐使用厂商提供的 PCB 焊盘方案以降低 tombstoning 风险。
- 采用无铅回流焊工艺时，遵循 JEDEC/IPC 推荐热爬升曲线，峰值温度参考 245–260℃（以厂家资料为准）。
- 避免在高温梯度或基板过度弯曲处贴装，防止应力导致裂纹。贴片前注意防潮保存，必要时按推荐进行烘烤除湿。
五、选型与应用建议
- 典型应用：电源去耦、模拟/数字滤波、EMI 抑制、耦合/旁路与小信号定时电路等。
- 在高可靠性或关键电路（如车载、医疗）中，须确认该型号是否有相应资格认证（例如 AEC‑Q200）并考虑额定电压降额；一般建议对 X7R 类电容在关键应用中按 50%–80% 的额定电压进行设计裕量以降低 DC‑bias 影响。
- 若电容对电压敏感度高或工作电压接近额定值，应测试实际工作点下的有效容值，并必要时选用更高额定电压或尺寸更大的封装。
六、可靠性与采购提示
- 建议索取并查阅 HRE（芯声）官方数据表与可靠性测试报告（温循环、湿热、机械冲击、焊接兼容性等）以确认满足项目需求。
- 采购时注意包装形式（卷装/带盘）、最小起订量与供货批次一致性；量产前做首件与批量电性能验证以避免线上问题。
如需该型号的完整数据表、PCB 推荐焊盘或应用测试数据，可提供用途与工作条件，我可协助查找与匹配更详尽的技术资料。
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