Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HRE CGA0603X7R105K250JT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X7R105K250JT
- Type
- 0603
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X7R105K250JT
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264495109
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X7R105K250JT 产品概述
一、产品简介
CGA0603X7R105K250JT 为一款贴片多层陶瓷电容（MLCC），额定容量为 1µF，公差 ±10%，额定电压 25V，温度系数为 X7R，封装尺寸为 0603（1608公制）。该产品由 HRE（芯声）提供，适用于对体积、稳定性和成本有均衡需求的消费电子与工业应用，是常见的去耦、旁路与滤波元件选择。
二、主要参数
- 容值：1µF
- 公差：±10%
- 额定电压：25V DC
- 温度特性：X7R（-55°C 至 +125°C，电容变化约 ±15%）
- 封装：0603（英制），适合高密度贴片装配
- 类型：多层陶瓷电容（MLCC）
三、特性与优势
- 体积小、贴装密度高，适合空间受限的电路板设计。
- X7R 介质在宽温范围内提供较好的电容稳定性，兼顾容量与可靠性。
- 低等效串联电阻（ESR）与低等效串联电感（ESL），适合高频去耦与瞬态响应需求。
- 0603 尺寸易于自动贴装与返修，成本相对较低，良品率高。
- 由品牌供应，能提供批量供货与质量控制支持。
四、典型应用场景
- 电源去耦与旁路（DC-DC 模块、线性稳压器输入/输出）。
- 高频滤波与耦合电路。
- 手机、平板、笔记本等消费电子的局部去耦与滤波。
- 工业控制、汽车电子（非关键安全回路需按车规确认）及物联网终端等场景。
五、封装与安装注意事项
- 0603 尺寸对焊盘设计与贴片精度要求高，建议按厂商推荐的焊盘尺寸与回流焊工艺参数进行设计。
- 陶瓷电容易发生机械应力导致裂纹，焊接或 PCB 弯曲时应避免过大热应力与机械应力。
- MLCC 存在直流偏压效应（DC bias），在接近额定电压时有效电容量会下降，设计时请考虑实际工作电压下的有效容值。
- 存储与贴装前避免潮湿环境，必要时遵循防潮包装与回流前烘烤要求。
六、质量与可靠性
- X7R 介质在温度循环与常规振动条件下表现稳定，适用于一般商业与工业级应用。
- 对于关键应用（如汽车安全、电源关键节点），建议参考厂商完整的可靠性测试报告，并考虑更高等级或车规认证元件。
- 建议在量产前进行样机试验，验证在目标环境和工况下的寿命与失效模式。
七、选型建议与替代方案
- 若需更高温度或更严格温漂，可考虑 C0G/NP0 等温度稳定性更高的介质，但容量密度和成本会受影响。
- 若关注在高偏压下维持容量，可评估更高额定电压或不同介质的方案。
- 市场上多家厂商（如国内外知名被动件厂）均有相同规格的 0603 X7R 1µF 25V 产品，可根据价格、供货稳定性与认证要求进行替换与比选。
总结：CGA0603X7R105K250JT 是一款通用性强、成本效益高的 0603 MLCC，适合绝大多数去耦与滤波场景。选择时请关注直流偏压效应、焊接工艺与应用环境，以保证最终电路的性能与可靠性。如需具体封装尺寸、焊盘建议或可靠性数据，请索取厂商详尽数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
