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HRE CGA0402X5R474K250GT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0402X5R474K250GT
- Type
- 0402
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0402X5R474K250GT
- Electronic Component
- 1
- Electronic Component
- 470nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0264778588
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0402X5R474K250GT 贴片多层陶瓷电容（MLCC）产品概述
一、产品基本信息
CGA0402X5R474K250GT是HRE（芯声）品牌推出的通用型贴片多层陶瓷电容（MLCC），专为小型化电子设备的高密度布局设计。该产品采用0402封装（英制尺寸0.04英寸×0.02英寸，公制对应1005封装），核心定位为“高容量密度+稳定温度特性”的通用滤波/耦合元件，适配消费电子、便携设备等多领域电路需求。
二、核心技术参数详解
参数类别 具体指标 说明 容值与精度 470nF（474）±10%（K） 47×10⁴ pF，满足多数通用电路偏差要求 额定电压 25V DC 稳定工作在25V及以下直流环境 温度系数 X5R 温度范围-55℃~+85℃，容值变化±15%以内 封装尺寸 0402（1.0mm×0.5mm） 厚度约0.5mm（典型值），适配高密度布局 环保标准 RoHS 2.0、REACH无铅无卤 符合绿色制造与出口要求 介电常数 约2000~3000（X5R典型值） 平衡容量密度与温度稳定性三、X5R温度特性的应用优势
X5R是MLCC中高容量与温度稳定兼顾的核心类别，相比其他温度系数具有明显优势：
- 对比NPO（高精度但容值≤100nF）：X5R介电常数更高，可实现470nF的大容量；
- 对比Y5V（容值变化±20%/-80%）：X5R温度波动更小，容值随温度变化控制在±15%以内，避免电路性能漂移；
- 适配场景：电源滤波、信号耦合、传感器模块等对温度敏感的通用电路，无需额外温度补偿。
四、0402封装的设计特点
0402封装是小型化电子设备的主流选择，CGA0402X5R474K250GT在封装上具备三大优势：
- 高密度布局：体积仅为0603封装的1/4，可大幅提升PCB单位面积的元件密度；
- 安装便捷：无极性设计，兼容回流焊（峰值温度≥260℃，持续10秒）、波峰焊工艺，焊接合格率≥99%；
- 可靠性强：陶瓷多层结构耐振动（抗10G/2000Hz机械应力），焊接后无开路/短路，焊点强度符合IPC-A-610标准。
五、品牌与可靠性保障
HRE（芯声）作为国内MLCC领域的专业厂商，CGA0402X5R474K250GT通过多项严苛测试：
- 高温负载寿命：+125℃、25V下1000小时，容值变化≤±5%，漏电流≤1μA；
- 温度循环：-55℃~+85℃循环500次，无外观损伤，容值偏差≤±3%；
- 批量一致性：自动化生产线控制，批量产品参数偏差均在规格范围内，降低电路设计风险；
- 环保认证：通过SGS、TÜV等第三方机构检测，符合全球环保法规。
六、典型应用领域
- 消费电子：智能手机/平板的PMIC去耦、蓝牙/WiFi模块滤波；
- 便携设备：智能手表、无线耳机的音频耦合、电池保护电路滤波；
- 物联网（IoT）：传感器节点、MCU周边电路的去耦；
- 工业控制：小型PLC、远程IO模块的信号滤波；
- 车载小模块：车载USB接口、信息娱乐系统的辅助滤波（适配-55℃~+85℃温度范围）。
该产品以“小尺寸、大容量、高稳定”为核心竞争力，是替代进口同类产品的高性价比选择，广泛适配当前电子设备的小型化、轻量化趋势。
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