WMSIC Electronic Components

HRE CGA0603X7R104K250JT

ModelCGA0603X7R104K250JT
Package0603
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0603X7R104K250JT
Type
0603
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0603X7R104K250JT
Electronic Component
1
Electronic Component
100nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264596043
Electronic Component
X7R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0603X7R104K250JT 产品概述

一、产品简介

CGA0603X7R104K250JT 为 HRE(芯声)品牌的一款0603 封装多层陶瓷贴片电容(MLCC),标称容值 100nF(0.1µF),公差 ±10%,额定电压 25V,介质材料为 X7R。该型号适用于对体积、成本和电性能有综合要求的消费类、通信及工业电子产品,用于旁路、去耦、滤波与储能等场景。

二、主要性能与优势

  • 小型化 0603 封装,节省 PCB 布局空间,适合高密度组装。
  • X7R 介质在 -55°C 至 +125°C 工况下具备较稳定的介电特性,适用于中温范围的去耦与旁路。
  • ±10% 公差可为电路提供较好的容值一致性,满足一般滤波与时间常数设计要求。
  • MLCC 特有的低等效串联电阻(ESR)和低等效串联电感(ESL),可实现快速瞬态响应。

三、电气与温度特性提示

X7R 属高介电常数陶瓷,容值受温度、频率与直流偏压影响。设计时应注意:

  • 温度特性:X7R 在规范温度范围内容值变化可见,但整体稳定性优于部分高K材料。
  • 直流偏压效应:施加高电压时实际容值会比静态标称值下降,尤其在小尺寸封装下更明显,必要时应进行偏压下的有效容值评估。
  • 频率响应:频率升高时容抗下降,滤波与去耦特性随频率变化,适当并联不同容值与封装可优化宽频带性能。

四、封装与物理特性

0603(英制)封装尺寸小,适合自动化贴片生产。该封装带来较低的 ESL,有利于高频去耦;但在高电压或大电流场合要注意热量与机械强度要求。建议在 PCB 设计中留意焊盘尺寸与应力缓冲。

五、典型应用场景

  • 电源去耦与旁路:CPU、MCU、PMIC 的近端去耦。
  • 高频滤波:射频前端的旁路与耦合(与其他容值并联以扩展频带)。
  • 信号线旁路与去耦:抑制瞬态噪声与供电回路耦合干扰。
  • 一般电子消费品与工业控制板块的通用去耦元件。

六、选型与布板建议

  • 对瞬态性能敏感的场合,可并联大电容与小电容(如 1µF 与 100nF)以覆盖宽频带。
  • 考虑 DC 偏压影响时,应在电路验证阶段测量偏压下的有效容值并留有裕度。
  • 布线时将电容放置于被去耦器件的电源引脚附近,尽量缩短回流路径并增大地平面连续性以降低回路电感。

七、焊接与储存注意事项

  • 支持常规回流焊工艺,建议遵循供应商回流曲线并控制峰值温度与时间。
  • 储存时避免潮湿、高温和强振动,长期存放前建议保持原包装并做外观检查。
  • 裸片在加工过程中注意防止机械应力与弯折,焊接后如发现裂纹应更换以避免早期失效。

八、可靠性与质量控制

HRE(芯声)产品通过常规电气与环境应力测试,适用于大多数民用与工业等级应用。最终产品设计应结合实际工况做加速老化、温度循环与偏压寿命验证,以确保在目标应用中的长期稳定性与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.