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HRE CGA0603X7R104K100JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X7R104K100JT
- Type
- 0603
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X7R104K100JT
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0265156134
- Electronic Component
- X7R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X7R104K100JT 多层陶瓷电容器（MLCC）产品概述
一、产品基本属性与型号解析
CGA0603X7R104K100JT是芯声（HRE） 推出的0603封装X7R介质多层陶瓷电容器（MLCC），型号各部分含义明确：
- CGA：芯声MLCC产品系列标识；
- 0603：英制封装尺寸（长0.06英寸×宽0.03英寸，对应公制1608，即1.6mm×0.8mm）；
- X7R：温度特性（-55℃~+125℃工作范围，容值偏差±15%以内）；
- 104K：容值与精度（104=10×10⁴pF=100nF，K=±10%精度等级）；
- 100：额定直流电压10V；
- JT：封装细节或生产批次标识（参考芯声官方 datasheet）。
该产品属于常规中容值MLCC，适配低电压、高密度PCB设计场景。
二、核心技术参数详解
参数类别 具体参数 说明 容值与精度 100nF（104pF）±10%（K档） 满足一般电路容值偏差需求 额定电压 DC 10V 交流纹波电压需与直流叠加后不超10V峰值 温度特性 X7R（-55℃~+125℃，容值变化≤±15%） 宽温稳定性优于Y5V等高介电介质 封装尺寸 0603（英制）/1608（公制） 体积小巧（1.6mm×0.8mm×0.5mm左右） 其他性能 tanδ≤0.015（典型值）、无极性 损耗低，安装无正反要求三、材料与结构特点
- 介质材料：采用X7R钛酸钡基陶瓷，兼具高介电常数（εr≈2000~3000） 与温度稳定性，平衡容值密度与性能；
- 电极结构：多层镍电极（Ni）堆叠，替代传统银电极，降低成本且提升抗迁移可靠性；
- 封装工艺：表面贴装（SMD），端电极为“镍+锡/纯锡”三层结构，适配回流焊/波峰焊，焊接可靠性高；
- 结构优势：多层叠层设计使单位体积容值提升数倍，相同容值下体积远小于单层陶瓷电容。
四、典型应用场景
因体积小、容值稳定、低电压适配性好，广泛用于：
- 消费电子：智能手机、平板的CPU供电滤波、音频电路耦合；
- 便携设备：蓝牙耳机、智能手环的电池滤波、传感器信号去耦；
- IoT终端：物联网节点的电源管理滤波、低功率无线模块匹配；
- 小型工业：传感器模块的信号耦合（非高压场景）。
注意：10V额定电压不适合汽车电子（需25V+）、高压电源等场景。
五、性能优势与适配性
- 高密度集成：0603封装适配PCB高密度布线，满足小型化设计趋势；
- 宽温稳定：-55~125℃范围内容值变化小，适合户外、工业宽温环境；
- 高可靠性：通过85℃/85%RH湿度负荷、温度循环等测试，寿命长；
- 成本可控：X7R介质比NP0（C0G）成本低，适合批量应用；
- 安装便捷：无极性设计，焊接无需区分正反，提升生产效率。
六、使用注意事项
- 电压限制：工作电压（直流+交流峰值）不得超过10V，避免过压损坏；
- 温度控制：存储/使用温度≤125℃，回流焊峰值温度≤260℃（符合IPC标准）；
- 静电防护：陶瓷电容对静电敏感，操作需佩戴ESD手环、用防静电工作台；
- 存储要求：常温（15~35℃）、干燥（湿度≤60%RH）环境，避免受潮（受潮易导致焊接爆板）；
- 焊接工艺：优先回流焊，波峰焊需防锡桥，焊接后可清洗残留助焊剂。
总结
CGA0603X7R104K100JT是芯声针对低电压小型化设备推出的高性价比MLCC，覆盖消费电子、便携设备等多数常规电路的滤波、耦合需求，是行业常用的基础器件之一。
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