WMSIC Electronic Components

HRE CGA0805X7R335K250MT

ModelCGA0805X7R335K250MT
Package0805
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0805X7R335K250MT
Type
0805
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0805X7R335K250MT
Electronic Component
1
Electronic Component
3.3uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.037g
Electronic Component
1
Electronic Component
BM0264596063
Electronic Component
X7R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0805X7R335K250MT 产品概述

一、主要参数

  • 品牌:HRE (芯声)
  • 型号:CGA0805X7R335K250MT
  • 容值:3.3 µF
  • 精度:±10% (K)
  • 额定电压:25 V DC
  • 温度特性:X7R(-55°C ~ +125°C,温度范围内容量变化≤±15%)
  • 封装:0805(约 2.0 mm × 1.25 mm,贴片型)

二、产品特性

  • X7R 介质兼顾温度特性与体积密度,适用于一般滤波与旁路应用。
  • 0805 小封装在占板面积与容量之间有良好折中,适合空间受限的中密度布板。
  • 低等效串联电阻(ESR)和较好的高频特性,便于去耦和稳压器输入/输出滤波。
  • 卷盘包装,兼容自动贴片机,便于批量生产。

三、典型应用

  • 电源去耦与旁路(DC-DC 转换器输入/输出、LDO 输出滤波)
  • 信号线旁路与去耦(数字与模拟混合电路)
  • 移动与便携设备、消费电子、工业控制模块的中小容量储能/滤波
  • 高频旁路与稳定电源瞬态响应改善

四、设计与使用建议

  • X7R 属二类介质,受直流偏压影响较明显;在额定电压下实际容量可能下降(视器件与尺寸而异),设计时考虑 DC-bias 效应,必要时选用更高电压或更大容量。
  • 对于关键滤波回路,建议保留裕量,常见做法为对关键轨道并联多只不同容量、不同封装的电容以兼顾低频储能与高频旁路。
  • 推荐采用符合 IPC/JEDEC 的回流焊规范;避免超温、超时的焊接工艺以免影响可靠性。
  • PCB 布局上尽量缩短电容与被去耦引脚间的回流路径,减少走线电感。

五、封装与可靠性

  • 0805 贴片封装适合自动化生产与高密度布板。
  • X7R 可靠性良好,耐温循环与一般工业环境;对湿度、机械应力及焊接热循环的敏感性应按厂商出具的可靠性数据评估。
  • 存储与贴装前应控制环境湿度,遵循防焊湿储存与回流前的干燥条件。

六、等效型号与采购建议

  • 查询替代型号时可检索关键参数:3.3 µF、25 V、X7R、0805、±10%。常见可替代厂商包括 Murata、TDK、Samsung、Yageo 等的同规格器件。
  • 选型时核对厂商数据手册中的 DC-bias 曲线、ESR、耐压与封装尺寸以保证互换性。
  • 推荐首批小批量试产验证实际电气性能与焊接兼容性,再行量产采购。

七、注意事项

  • 使用前请参考 HRE(芯声) 的完整技术资料与检验报告,以获取 ESR、等效串联电感(ESL)、温漂与 DC-bias 曲线等详尽参数。
  • 关键应用(如高精度模拟或高脉冲电流场合)应进行实际板级测试,必要时采用陶瓷类以外的电容或并联组合以满足系统要求。

本产品适用于对体积、成本与电性能有平衡要求的通用去耦与滤波场景,建议基于具体电路与工作条件参照厂方数据手册进行最终设计确认。

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