WMSIC Electronic Components

HRE CGA0805X7R224K500KT

ModelCGA0805X7R224K500KT
Package0805
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0805X7R224K500KT
Type
0805
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0805X7R224K500KT
Electronic Component
1
Electronic Component
220nF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.04g
Electronic Component
1
Electronic Component
BM0264599111
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0805X7R224K500KT 产品概述

一、产品基本参数

  • 型号:CGA0805X7R224K500KT
  • 品牌:HRE(芯声)
  • 容值:220nF(0.22μF)
  • 精度:±10%(K)
  • 额定电压:50V
  • 温度系数/材质:X7R(-55°C 至 +125°C,温度下电容量变化属陶瓷介质特性)
  • 封装:0805(2012英制)

二、产品特点与优势

该型号采用X7R介质,能在较宽的温度范围内提供较大的容值,体积小、单位容值高,适合空间受限的应用。0805封装兼顾装配可靠性与布局密度,适合贴片回流焊工艺。相较于高稳定度的C0G/NP0,X7R在体积与容量密度上更有优势,适用于旁路、去耦与能量缓冲等场合。

三、典型应用场景

  • 电源去耦与旁路:抑制高频噪声,稳定电源轨
  • EMI/滤波电路:结合电感、电阻组成滤波网络
  • 耦合/旁路:信号链中常见的高频耦合或局部去耦
  • 能量储存与瞬态响应:用于缓冲短时电流波动,尤其在空间受限的移动或便携设备中表现良好

四、性能注意事项与选型建议

  • DC偏压效应:X7R类MLCC在施加高电压时会出现显著的电容量下降,设计时应考虑50V工作电压下的有效容量减少,必要时选择更大容值或更高电压等级以保证所需电容。
  • 温度依赖性:X7R允许温度引起的容值变化,若电路对容值稳定性要求高(定时、滤波精度),建议使用C0G/NP0材质。
  • 老化效应:陶瓷介质随时间可能出现容值下降,长期可靠性设计需留有裕量。
  • 焊接与回流:适用于标准回流焊工艺,遵循厂家建议的温度曲线和焊接参数,避免过高的热应力和PCB弯曲导致器件破裂。

五、可靠性与储存

HRE(芯声)生产的片式陶瓷电容在绝缘电阻、耐压和机械强度方面通过常规可靠性测试。建议在干燥环境中存放,防止吸湿和污染;领用前如长时间存放建议进行烘烤除湿处理以避免回流焊时的焊接缺陷。

六、采购与替代建议

该型号常见于卷带(Tape & Reel)包装,适配自动贴片生产线。选型时若担心DC偏压或温度漂移,可考虑容量更大或更高额定电压的X7R同家族产品,或在要求高稳定环境下改用C0G/NP0材质。采购时关注批次一致性与可靠性测试报告,必要时索取样品与规格书进行实测验证。

以上为CGA0805X7R224K500KT的技术概述与应用建议,供设计与选型参考。若需该型号的详细电气参数曲线(DC偏压特性、温度特性、等效串联电阻ESR/ESL等)或焊接曲线,请提供具体要求以便查阅厂方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.