WMSIC Electronic Components

HRE CGA1210X7R104K631QT

ModelCGA1210X7R104K631QT
Package1210
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA1210X7R104K631QT
Type
1210
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA1210X7R104K631QT
Electronic Component
1
Electronic Component
100nF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.124g
Electronic Component
1
Electronic Component
BM0264596057
Electronic Component
X7R
Voltage
630V
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA1210X7R104K631QT 产品概述

一、产品简介

CGA1210X7R104K631QT 是 HRE(芯声) 出品的贴片多层陶瓷电容(MLCC),规格为 100nF(104)、公差 ±10%(K),额定电压 630V,采用 X7R 温度特性,封装为 1210(公制 3216)。该器件适用于需要高耐压、小体积滤波、耦合与去耦的电源与高压模块。

二、主要性能参数

  • 容值:100nF(0.1µF)
  • 公差:±10%
  • 额定电压:630V DC
  • 温度特性:X7R(-55°C 至 +125°C,温度引起的电容变化在 ±15% 级别)
  • 封装:1210(约 3.2 × 2.5 mm,厚度视具体产品而定)
  • 封装方式:贴片(可供带卷/Reel)

三、特性与优点

  • 高耐压:630V 额定,适合中高压电路应用。
  • 容量密度高:1210 封装在体积受限情况下提供 0.1µF 的滤波能力。
  • 温度性能稳定:X7R 在宽温区间内保持较小的电容漂移,适合一般电源应用。
  • 工艺兼容:适用无铅回流焊(JEDEC/J-STD-020 标准),可实现自动贴装与高产能制造。
  • RoHS 合规,适配现代环保要求。

四、典型应用场景

  • 开关电源输入/输出滤波与去耦
  • DC-DC 转换器、高压驱动及 LED 驱动电路的旁路/耦合
  • 电机驱动与逆变器控制板的局部滤波
  • 测试与测量设备、高压分压及耦合回路

五、设计与使用建议

  • DC 偏压效应:X7R 为高介电常数材料,在高电场下电容值会显著下降(随电压增加而减小),在设计时请留有裕量并在实际工作电压下验证电容值。
  • 降额与可靠性:对于关键或长期可靠性要求的系统,建议考虑降额使用(例如按应用需求在额定电压的 60%~80% 范围内设计)并评估温度与湿度影响。
  • 焊接与处理:遵循无铅回流焊峰值温度(260°C)及器件厂商给出的焊接曲线,避免超出热应力导致裂纹或机械损伤。
  • PCB 布局:电源去耦时靠近 IC 电源引脚放置,缩短回流路径;高压应用注意保持爬电距离与清洁,避免表面漏电。
  • 贮存与预处理:潮湿环境下建议烘烤处理后再回流焊;长期贮存应防潮、防震。

六、包装与选型提示

  • 零件型号含义(示例解析):CGA = MLCC 系列,1210 = 封装,X7R = 介质,104 = 100nF,K = ±10%,63/1 = 630V,QT = 厂家特殊代码(终端处理/包装形式等)。
  • 选型时除容值、电压与封装外,请确认实际工作电压下的电容保持率、耐压测试条件、机械高度限制及焊膏/回流工艺兼容性。
  • 可与市场上同等级高压 X7R MLCC 做等效替换,采购时核对批次、温漂与可靠性测试报告。

如需器件详细的尺寸图、等效电路(ESR/ESL)参数或在特定电压/温度下的电容保持曲线,可提供进一步数据表查询与实测建议。

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