WMSIC Electronic Components

HXY MOSFET HRCLAMP0551P

ModelHRCLAMP0551P
PackageDFN1006-2L
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET HRCLAMP0551P
Type
HXY MOSFET
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
HRCLAMP0551P
Electronic Component
1
Package
DFN1006-2L
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.007g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.5pF
Electronic Component
BM0257671860
Operating Temperature
55℃~+150℃
Voltage
25V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HRCLAMP0551P 产品概述

一、产品简介

HRCLAMP0551P 是华轩阳电子(HXY MOSFET)推出的一款单路双向瞬态抑制器(ESD/浪涌保护元件),采用微型 DFN1006-2L 封装,针对对信号完整性要求高且需承受静电放电与快速瞬态脉冲的低电压接口而设计。器件工作稳压(Vrwm)为 5V,具备高能量吸收能力与极低结电容,适用于移动终端、通信接口和工业控制等场景。

二、主要参数

  • 极性:双向(对正负尖峰均有效)
  • 工作稳压 Vrwm:5 V
  • 击穿电压(Vbr):6 V(典型)
  • 钳位电压(Vclamp):25 V(在指定脉冲条件下)
  • 峰值脉冲电流 Ipp:4 A
  • 峰值脉冲功率 Ppp:100 W(8/20 μs 波形)
  • 反向/漏电流 Ir:100 nA(典型工况)
  • 结电容 Cj:0.5 pF(低电容,有利于高速信号)
  • 通道数:单路
  • 工作温度:-55 ℃ ~ +150 ℃
  • 防护等级:符合 IEC 61000-4-4(快速瞬变)与 IEC 61000-4-2(静电放电)标准
  • 封装:DFN1006-2L(微型,便于高密度布局)

三、性能特点

  • 双向保护:可在信号线出现正负极性瞬态时提供对称保护,适合差分或双向信号线路。
  • 低电容(0.5 pF):对高速数据线影响极小,可用于 USB、串行总线及其他高频接口,减少信号失真与抖动。
  • 高能量吸收:在 8/20 μs 波形下可承受 100 W 的瞬态功率,峰值电流 4 A,可应对常见的浪涌与脉冲事件。
  • 宽温度范围与高可靠性:适合苛刻环境与工业级应用,长期工作温度可达 150 ℃。
  • 小型封装:DFN1006-2L 有利于端口保护模块的紧凑设计与自动贴片加工。

四、典型应用

  • 智能手机、平板等移动终端的 I/O 接口保护(充电口、按键、耳机等)
  • 工业控制器与传感器接口的静电与浪涌防护
  • 通信设备的接口线缆防护(串口、GPIO、低压差分对)
  • 耐受 IEC ESD/Fast Transient 要求的现场设备与仪器

五、封装与布局建议

  • 将 HRCLAMP0551P 靠近受保护引脚放置,走线尽量短且宽,以降低串联阻抗。
  • 器件地脚应与系统接地良好连接,必要时在附近设置低阻抗回流路径与地平面。
  • 对于高能量脉冲应用,增大焊盘与地铜面积以利于热量分散,避免长期过热。
  • 避免在器件附近放置敏感模拟电路,以防钳位噪声耦合。

六、注意事项与可靠性

  • 钳位电压为在规定脉冲条件下测得的值,实际系统中的夹紧电压会受源阻抗与印制板布局影响。
  • 若需保护多路信号,应为每一路分别配置保护元件或选择多通道器件;避免将单一路用于多线并联承受高能量脉冲。
  • 在高频应用中,器件的结电容虽低,但仍应在系统级进行信号完整性验证。
  • 储存与焊接遵循常规无铅回流工艺要求,避免长期高温或潮湿环境导致性能退化。

如需针对特定接口(例如 USB2.0、CAN 或差分信号)进行选型比较或布局优化建议,可提供电路示意与使用场景以便给出更精确的方案。

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