WMSIC Electronic Components

HXY MOSFET HTP4056

ModelHTP4056
PackageESOP-8
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET HTP4056
Type
ESOP-8
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
HTP4056
Electronic Component
1
Package
ESOP-8
Electronic Component
Battery Management
Electronic Component
0.158g
Electronic Component
1
Features
Programmable Current
Electronic Component
BM0227488645
Operating Temperature
40℃~+85℃
Operating Voltage
4.5V~8V
Battery Type
Battery
Battery
1
ICType
IC
0VBattery
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HTP4056 产品概述

一、产品简介

HTP4056(品牌:HXY MOSFET / 华轩阳电子,封装:ESOP-8)是一款面向单节锂离子/锂聚合物电池的线性充电管理芯片。器件支持从0V起始的深度放电电池唤醒充电,采用恒流—恒压(CC/CV)充电策略,充至终止电压为4.2V。器件适用于便携设备、可穿戴、消费类电子、物联网终端及电池模块充电管理等场景。

主要电气与环境参数(摘要)

  • 最大充电电流:1.2A(可通过外部电阻编程)
  • 工作电压(供电输入):4.5V ~ 8V
  • 电池节数:1 节(单节锂电池)
  • 静态电流(Iq):55 µA(芯片待机/静态电流)
  • 工作温度:-40℃ ~ +85℃
  • 充电饱和/终止电压:4.2V(典型)
  • 0V电池充电:支持(对深放电电池有预充/唤醒功能)
  • 电池温度检测:支持(通过外部热敏阻抗实现电池温度监测)
  • 封装形式:ESOP-8

二、主要特点

  1. 支持从0V起充电:对远低于正常电压的电池能安全实现预充电与唤醒。
  2. 可编程恒流充电:外部设定电阻(RPROG)设定充电电流,最大可达1.2A,设计灵活。
  3. CC/CV 充电曲线:先恒流快速充至接近4.2V,随后进入恒压阶段并在电流下降到终止值时结束充电。
  4. 电池温度检测:支持连接NTC以实现充电温度上下限检测,增强安全性。
  5. 低静态电流:典型55 µA,适合对待机功耗要求高的应用。
  6. 宽输入电压范围:4.5V~8V,兼容多种供电源(USB、适配器等)。

三、典型功能与外部电路建议

  • 编程电阻(RPROG):通过在PROG引脚接入一个外部电阻来设定充电电流。典型计算公式(厂商常见实现)为 ICHG ≈ 1200 / RPROG(单位:mA 与 kΩ 对应),例如要接近最大1.2A,则RPROG约为1 kΩ(请以最终器件手册为准)。
  • 状态指示:器件通常提供状态引脚(开漏/开路输出),可外接LED与限流电阻显示充电/完成状态。
  • 输入去耦与输出滤波:建议在VCC与GND之间放置合适的陶瓷电容以抑制输入纹波及瞬态;BAT端可加小值电容提高稳定性(参考器件数据手册)。
  • 电池温度检测:在TEMP引脚接入NTC(通常10k@25°C)与地进行分压,以实现充电温度范围检测(需按数据手册选择阈值)。
  • 安全保护:建议在设计中结合外部保险丝、反接保护二极管、以及必要的热量管理和过流保护电路,以提升系统可靠性。

四、工作流程(典型)

  1. 电源接入(VCC)后,芯片检测电池电压:若电池电压极低,进入预充(涓流)阶段,限制电流对电池温和唤醒;
  2. 电池电压上升至预设阈值后进入恒流(CC)阶段,按设定的编程电流快速充电;
  3. 当电池电压接近4.2V时,进入恒压(CV)阶段,电压被稳压在4.2V;
  4. 当充电电流下降至终止门限(通常为设定电流的一定比例,如十分之一,具体以芯片说明为准)时,充电结束并进入涓流或断开充电状态;
  5. 温度异常或外部错误时,芯片会依据TEMP等引脚状态停止或限制充电以保护电池。

五、设计与布局注意事项

  • 散热考虑:ESOP-8封装在大电流工作时会产生热量,应在PCB上提供足够的散热面积与过孔,并靠近芯片放置PCB散热层。
  • 输入路径与电流回路:高电流路径(VCC、BAT、GND)宜采用宽铜箔、短轨迹,降低压降与发热。
  • 测试与调校:在样机验证阶段,通过真实电池和负载监测温升、充电曲线与终止行为,确认RPROG与NTC阈值设置合理。
  • ESD与EMC:加入输入滤波与TVS器件以提高抗干扰性和静电保护能力,必要时增加共模电感。

六、典型应用场景

  • 便携消费电子(蓝牙耳机、便携播放器)
  • 手持设备与遥控器
  • IoT 终端与智能传感器节点
  • 移动电源/充电模块(单节拓扑)
  • 小型电池组充电保活电路

七、可靠性与安全提示

  • 在高温环境或长时间大电流充电下,注意电池与芯片发热,必要时加入温控或限流策略。
  • 使用合格电芯并配套必要的保护电路(PTC/保险丝、反接保护、BMS/保护板)以避免异常故障。
  • 所有外接元件(电阻、电容、NTC等)的额定功率与温漂须满足长期工作要求。

结语:HTP4056 以其支持0V唤醒、可编程1.2A大电流、低静态电流及电池温度检测等特性,适合单节锂电池的高可靠性充电管理设计。具体电路参数与引脚定义、典型应用电路与热设计细节,请参照华轩阳电子(HXY MOSFET)官方数据手册以获得完整准确的实施规范。

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