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HXY MOSFET M7F
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HXY MOSFET M7F
- Type
- HXY MOSFET
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HXY MOSFET
- Electronic Component
- M7F
- Electronic Component
- 1
- Package
- SMAF
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.08g
- Electronic Component
- 1
- Electronic Component
- BM0227249423
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 5uA@1kV
- (Vf)
- 1V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
M7F 产品概述
一、产品简介
M7F 是华轩阳电子（HXY MOSFET）推出的一款独立式通用二极管，封装为 SMAF。该器件面向高压直流整流与一般保护电路设计，具有较高的反向耐压和低反向漏流特性，适用于需要在较高电压下工作但电流不大的场合。
二、主要参数与电气特性
- 二极管配置：独立式（分立封装）
- 正向压降：Vf = 1.0 V @ IF = 1 A
- 直流反向耐压：Vr = 1000 V (1 kV)
- 额定整流电流：IF(AV) = 1 A
- 反向电流：Ir = 5 μA @ Vr = 1 kV
- 非重复峰值浪涌电流：Ifsm = 30 A（单次峰值浪涌能力）
- 工作结温范围：TJ = -55 ℃ ～ +150 ℃
- 品牌：HXY MOSFET（华轩阳电子）
- 封装：SMAF
三、产品特点
- 高耐压：1 kV 的直流反向耐压使其适合高压整流与高压保护应用。
- 低漏电流：在满耐压条件下反向漏流仅 5 μA，适用于高阻或要求低泄漏的电路。
- 良好浪涌承受力：30 A 的非重复峰值浪涌能力，可承受短时启动或瞬态冲击。
- 宽温度范围：-55 ℃ 至 +150 ℃ 的结温范围，适应工业级恶劣环境。
- 封装便于贴片装配：SMAF 封装兼顾体积与安装可靠性，适合自动化贴装和波峰/回流焊工艺。
四、典型应用
- 高压整流电路（高压电源、离子电源等）
- 开关电源次级或高压侧整流
- 保护与反向阻断（防止反向电流、整流保护）
- 测试设备、测量仪器以及工业电源系统中的高压回路
- 高压充电电路、脉冲源的整流与钳位
五、使用与设计注意事项
- 热设计：在 IF = 1 A、Vf ≈ 1 V 时，二极管耗散约 1 W（P = Vf×I），需考虑封装散热路径与 PCB 散热设计，必要时应做适当的降额使用。
- 浪涌限制：Ifsm = 30 A 为非重复峰值浪涌，设计时应避免频繁或长时间的脉冲浪涌，否则会降低寿命或损坏器件。
- 反向漏流：尽管在 1 kV 时漏流仅 5 μA，但在高温或长期工作下可能增大，应在高阻电路中验证实际漏电对系统的影响。
- 动态特性：本概述未提供反向恢复时间等开关动态参数，若用于高频开关场合，请向厂商索取完整数据表以确认反向恢复特性和损耗。
- 焊接与储存：按厂商推荐的回流/波峰焊工艺和防潮要求操作，避免超过推荐峰值温度和潮湿导致的焊接可靠性问题。
六、封装与采购信息
型号：M7F
品牌：HXY MOSFET（华轩阳电子）
封装：SMAF
建议在采购或批量设计前向华轩阳索取完整数据手册（Datasheet），以获取热阻、最大功耗、回流焊工艺参数、可靠性测试与典型电路图等详细信息，确保在具体应用中满足性能与可靠性要求。
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