WMSIC Electronic Components

HXY MOSFET BAT54A

ModelBAT54A
PackageSOT-23
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET BAT54A
Type
HXY MOSFET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
BAT54A
Electronic Component
1
Package
SOT-23
Electronic Component
Schottky Diode
Electronic Component
0.037g
Electronic Component
1
Electronic Component
BM0227691798
Current
100mA
Diode
1
Current(Ir)
2uA@25V
(Vf)
1V@100mA
Electronic Component
40℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAT54A 肖特基二极管(1对共阳极)产品概述

一、产品简介

BAT54A 是一款双路肖特基势垒二极管,采用 1 对共阳极(common‑anode)配置,由 HXY MOSFET(华轩阳电子)供应,SOT‑23 封装。器件面向小信号整流、钳位与低压快速切换场合,具有低正向压降与小反向漏电的特点,适合自动化与消费电子中对体积和开关速度有要求的应用。

二、主要特性

  • 1 对共阳极配置,两个阴极独立,便于二路通道设计或双向保护电路布局。
  • 正向压降 Vf = 1.0 V @ 100 mA(典型工作点),降低功耗与发热。
  • 直流反向耐压 Vr = 30 V,适用 12 V/24 V 等低压系统。
  • 额定整流电流 If = 100 mA(连续),满足小功率整流需求。
  • 反向电流 Ir ≤ 2 μA @ 25 V,低漏电,利于高阻态保持与低功耗系统。
  • 非重复峰值浪涌电流 Ifsm = 600 mA,可承受短时浪涌/启动冲击。
  • 工作结温范围:-40 ℃ ~ +125 ℃,适合工业级温度要求。
  • SOT‑23 小封装,便于表面贴装与高密度 PCB 布局。

三、电气参数(典型值)

  • 正向压降(Vf):1.0 V @ If = 100 mA
  • 反向耐压(Vr):30 V
  • 连续整流电流(If):100 mA
  • 反向漏电流(Ir):≤ 2 μA @ Vr = 25 V, Ta = 25 ℃
  • 浪涌能力(Ifsm):600 mA(单次、非重复)
  • 工作结温:-40 ~ +125 ℃

四、封装与引脚

  • 封装:SOT‑23(表面贴装,三引脚)
  • 引脚功能:共阳极(Anode,共用)与两路阴极(Cathode1、Cathode2)。该形式便于实现双路并行或独立整流/钳位。具体引脚号请参考华轩阳电子的封装图纸(不同厂家引脚编号可能略有差异)。

五、典型应用场景

  • 快速小信号整流与检波电路
  • 电源反接保护、极性选择(OR‑ing)与输入钳位
  • 逻辑电平移位、功率路径切换
  • USB、通信接口的浪涌抑制与防反接保护
  • 便携设备、传感器前端、开关电源二极管管脚

六、使用建议与注意事项

  • 长期工作电流建议不超过 100 mA,并在高温下进行功率热沉与降额设计。
  • 浪涌电流 Although Ifsm 可达 600 mA,仅限短时非重复脉冲,避免重复或长时间浪涌。
  • PCB 布局尽量缩短走线、增大散热铜箔面积,必要时在地/电源层增加过孔以利散热。
  • 若系统对正向压降敏感,可并联多颗器件或选用更低 Vf 的大电流肖特基方案。
  • 生产选型时核对华轩阳电子的最新数据手册与封装图,确认引脚排列与包装形式(卷带/托盘)。

七、订购信息与替代建议

  • 品牌:HXY MOSFET(华轩阳电子)
  • 封装:SOT‑23(表面贴装)
  • 建议订购型号示例:HXY‑BAT54A‑SOT23(具体料号以供应商目录为准)
  • 常见替代型号:市面上有多家厂商生产 BAT54A 等效器件,选型时注意 Vf、Vr、Ir 与封装一致性以保证性能兼容。

如需数据手册、封装尺寸图或样片评估建议,可提供电路工作点与环境条件,我可进一步给出热设计与并联/保护电路的详细建议。

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