WMSIC Electronic Components

HXY MOSFET DMG2305UX-7

ModelDMG2305UX-7
PackageSOT-23
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET DMG2305UX-7
Type
SOT-23
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
DMG2305UX-7
Electronic Component
1
Package
SOT-23
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
Electronic Component
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0258661566
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.31W
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DMG2305UX-7 产品概述

一、产品简介

DMG2305UX-7 是华轩阳电子(HXY MOSFET)推出的一款 P 沟道场效应管,采用 SOT-23 小型贴片封装,额定漏源电压 Vdss=20V、连续漏极电流 Id=5A。该器件导通电阻标称为 RDS(on)=45mΩ(在 Vgs=–4.5V、Id=3.4A 条件下测得),耗散功率 Pd=1.31W,栅极阈值电压 Vgs(th)≈0.4V。器件适合空间受限、对开关速度和功耗有中等要求的便携式和电源管理场景。

二、主要电气参数(关键指标)

  • 类型:P 沟道 MOSFET(P-channel)
  • 封装:SOT-23(单片,贴片)
  • 漏源电压 Vdss:20V
  • 连续漏极电流 Id:5A(器件级数值,实际可用电流受 PCB 热阻与环境影响)
  • 导通电阻 RDS(on):45mΩ @ Vgs=–4.5V, Id=3.4A
  • 阈值电压 Vgs(th):≈0.4V
  • 总栅极电荷 Qg:14.3nC @ Vgs=4.5V
  • 输入电容 Ciss:≈1.2nF @ 15V
  • 反向传输电容 Crss:≈151pF @ 15V
  • 功耗 Pd:1.31W
  • 工作结温范围:-55℃ ~ +150℃

三、特性与优势

  • 小型封装:SOT-23 体积小、适合高密度 PCB 布局与便携设备。
  • 低导通损耗:在典型驱动电压下 RDS(on) 45mΩ,可在中等电流下保持较低功耗。
  • 宽温度范围:适用于工业级温度需求,可靠性高。
  • 中等开关性能:Qg=14.3nC 与 Ciss=1.2nF 表明在 4.5V 驱动下开关损耗与驱动能力处于中等水平,适合开关频率不极高的场合。

四、典型应用场景

  • 电池管理与电源逆向保护:适合作为高端电源开关或负载断开器(高侧 P 沟道实现简易高边开关)。
  • 便携式设备电源切换:手机、平板、便携仪器等需要小体积电源控制。
  • 低压电源分配与功率管理模块(PMIC)中的开关元件。
  • 低至中等频率 DC-DC 转换器的同步整流或MOS开关(需评估 Qg 与开关损耗)。

五、使用建议与注意事项

  • 热管理:SOT-23 封装的散热能力有限,Pd=1.31W 为理想散热条件下数值。实际使用中需通过增加 PCB 铜箔面积、使用散热过孔或降低连续电流来控制结温,避免热失效。
  • 驱动电压:RDS(on) 以 Vgs=–4.5V 测得,若使用较低驱动电压,导通电阻会上升。阈值电压较低(≈0.4V),但为保证低损耗建议提供接近 –4.5V 的栅极驱动(针对 P 沟道请参考电路极性)。
  • 开关速度与驱动能力:Qg=14.3nC 和 Ciss=1.2nF 指出在较高开关频率下驱动损耗显著。若用于开关频率较高的应用,应配合低阻抗驱动器、合理的栅阻以及评估开关损耗与热耗散。
  • PCB 布局:靠近 MOSFET 的大面积铜箔和短低阻连接可降低热阻与寄生电感,减小功率损耗和振铃。栅极建议并联合适的栅阻以抑制振荡。
  • 引脚说明:SOT-23 小封装便于贴装。常见引脚排列为 G、S、D 等,请以器件正式规格书或样片丝印为准,避免直接依据第三方资料导致接错。

六、选型提示

DMG2305UX-7 适用于要求小体积、20V 级别且电流处于几安培范围的 P 沟道开关场合。若需要更低的 RDS(on) 或更高频率的开关性能,可考虑更大封装或钳制更低 Qg 的器件;若热裕量受限,应优先评估功率分布与 PCB 散热方案。

如需设计建议(驱动电路、PCB 散热布局或并联使用方案),可提供电路拓扑与预期工作条件,我可给出更具体的计算与布局建议。

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