WMSIC Electronic Components

HXY MOSFET DMN6040SSD-HXY

ModelDMN6040SSD-HXY
PackageSOP-8
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET DMN6040SSD-HXY
Type
SOP-8
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
DMN6040SSD-HXY
Electronic Component
1
Package
SOP-8
Electronic Component
2 N
Type
N
Electronic Component
MOSFET
Electronic Component
Electronic Component
Electronic Component
0.127g
Electronic Component
1
Electronic Component
BM0257297292
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
2.1W
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DMN6040SSD-HXY 产品概述

一、概述

DMN6040SSD-HXY 是华轩阳电子(HXY)推出的双通道独立 N 沟道功率 MOSFET,封装为 SOP-8,适用于中低电压功率开关与管理场合。每通道额定漏源电压 60V、连续漏极电流 6.5A,导通电阻 32mΩ(Vgs=10V),在体积与成本受限且需双路独立控制的电路中具有较好性价比。

二、主要电气参数

  • 通道数量:2 个独立 N 沟道
  • 漏源电压 Vdss:60V
  • 连续漏极电流 Id:6.5A(封装及散热条件限制)
  • 导通电阻 RDS(on):32mΩ @ Vgs=10V
  • 阈值电压 Vgs(th):约 1.4V
  • 总耗散功率 Pd:2.1W(SOP-8 封装,需合理 PCB 散热)
  • 栅极电荷 Qg:50nC @ Vgs=10V
  • 输入电容 Ciss:1.92nF,输出电容 Coss:155pF,反向传输电容 Crss:116pF
  • 工作温度:-55 ℃ ~ +150 ℃

三、特性与优势

  • 双通道独立设计,便于在同一封装内实现两路功率开关或桥臂配置,节省 PCB 面积。
  • 在 10V 栅压下低至 32mΩ 的导通电阻,有利于降低导通损耗(在 6.5A 时 I^2R 损耗约 1.35W)。
  • 相对齐全的栅极/输入电容参数,便于估算开关损耗与选择驱动器。
  • 宽温度范围与典型工业级规格,可靠性适合一般工业与消费类设备。

四、应用场景

  • DC-DC 升降压转换器的下/高端开关(中低频)
  • 电机控制与驱动(需注意峰值电流与散热)
  • 电池管理与保护、电源切换、负载开关
  • LED 驱动与一般功率开关场合

五、设计与使用建议

  • 栅极驱动:建议采用近 10V 的驱动电压以达到标称 RDS(on),若仅使用 4.5V 或 3.3V 驱动,导通电阻会显著上升,应验证导通损耗。
  • 开关频率:Qg=50nC,Ciss≈1.92nF,适合中低频应用;若高频工作(数百kHz 以上),需评估驱动器能力及开关损耗,并增加栅极电阻以抑制振铃。
  • 热管理:器件 Pd=2.1W 为理想散热条件下数值,SOP-8 封装对 PCB 散热依赖大,建议尽量使用热铜箔、散热过孔并考虑功率降额设计。
  • 抗干扰与保护:为抑制开关尖峰,建议并联抑制电路(RC、TVS)并在栅极加阻尼电阻与钳位,避免 Crss 引起的 Miller 效应导致误触发。
  • 布局注意:将电流回路短且粗,确保栅极接地回路干净,靠近驱动器布局以减少寄生。

六、选型与采购提示

  • 若系统要求高频高效开关或更低导通电阻,可考虑 RDS(on) 更低或更适合低压栅驱的 MOSFET。
  • 在批量采购或替换时,确认封装脚位、热阻与实际电流/温升测试结果,避免仅看额定值导致实际系统过热或失效。

DMN6040SSD-HXY 在双路独立、60V 档位的应用中提供了平衡的导通性能与成本,是中低频功率管理与开关场合的可靠选择。

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