WMSIC Electronic Components

HXY MOSFET ESD5Z3.3-HXY

ModelESD5Z3.3-HXY
PackageSOD-523
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET ESD5Z3.3-HXY
Type
SOD-523
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
ESD5Z3.3-HXY
Electronic Component
1
Package
SOD-523
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.024g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
60pF
Electronic Component
BM0259384617
Operating Temperature
40℃~+125℃
Voltage
8.4V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD5Z3.3-HXY 产品概述

一、产品简介

ESD5Z3.3-HXY 是华轩阳电子(HXY MOSFET)推出的一款单路单向静电放电(ESD)保护器件,采用 SOD-523 超小封装。针对 3.3V 电平接口进行了优化,能在突发静电或脉冲干扰下对敏感器件提供快速钳位保护,适用于移动终端、通信、消费类电子和工业控制等对空间和成本敏感的应用场景。

二、主要参数(典型值)

  • 极性:单向
  • 反向截止电压 Vrwm:3.3 V
  • 钳位电压(Vc):8.4 V
  • 峰值脉冲电流 Ipp:11.2 A
  • 峰值脉冲功率 Ppp:90 W(8/20 μs)
  • 击穿电压(Vbr):5 V
  • 反向泄漏电流 Ir:1 μA
  • 结电容 Cj:60 pF
  • 通道数:单路
  • 工作温度范围:-40 ℃ 至 +125 ℃
  • 防护等级:符合 IEC 61000-4-2(ESD)与 IEC 61000-4-4(EFT)
  • 封装:SOD-523

三、特性与优势

  • 针对 3.3V 电平设计,反向截止电压精确,兼容常见逻辑与接口电压。
  • 低钳位电压(8.4V),在大电流冲击下能有效限制电压尖峰,保护后级芯片。
  • 高峰值脉冲能力(11.2A / 90W @8/20μs),能承受典型人体和系统脉冲能量。
  • 结电容 60 pF,在多数数字信号线中对信号完整性的影响较小,适合高速接口保护。
  • SOD-523 封装体积小,利于高密度 PCB 布局与自动贴装处理。

四、典型应用

  • 3.3V 单片机 I/O、通信接口(UART、I2C、SPI)保护
  • USB、耳机、音视频接口的防静电保护(要求低容抗场合)
  • 移动设备与可穿戴设备的外部接口保护
  • 工业控制与物联网模块的局部浪涌/静电防护

五、使用建议与布板要点

  • 将器件尽量靠近受保护的接口引脚布置,缩短导线长度以降低等效串联电感。
  • 为获得最佳性能,保护器负极应直接接地并联接到器件地平面,避免长回流路径。
  • 在高频/高速信号上使用时需评估 Cj 对信号带宽的影响,必要时采用差分或其他屏蔽措施。
  • 安装与回流焊符合 SOD-523 温度规范,避免超温影响器件性能与寿命。

如需样品、器件图纸(PCB 尺寸、封装引脚定义)或更多可靠性与测试数据,请联系华轩阳电子技术支持。

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