WMSIC Electronic Components

HXY MOSFET BZT52B5V1S

ModelBZT52B5V1S
PackageSOD-323
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET BZT52B5V1S
Type
SOD-323
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
BZT52B5V1S
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.026g
Electronic Component
1
(Zzk)
480Ω
(Zzt)
60Ω
Electronic Component
BM0258662142
Diode
1
Current(Ir)
2uA@2V
Power Dissipation(Pd)
200mW
Electronic Component
5V~5.2V
Electronic Component
40℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52B5V1S 产品概述

一、产品简介

BZT52B5V1S 是一款独立式小功率稳压二极管,采用 SOD-323 小型封装,由华轩阳电子(HXY MOSFET)供应。该器件标称稳压值为 5.1V(稳压范围 5.0V~5.2V),适用于对占位空间和功耗有严格要求的低功耗电源与信号保护场合。器件工作结温范围宽 (-40℃ ~ +125℃),适应常见工业与民用环境。

二、主要电气参数

  • 稳压值(标称):5.1V
  • 稳压值范围:5.0V ~ 5.2V
  • 反向电流 Ir:2 μA @ 2V
  • 耗散功率 Pd:200 mW(最大)
  • 稳态阻抗 Zzt:60 Ω
  • 峰值/静态阻抗 Zzk:480 Ω
  • 工作结温范围:-40℃ ~ +125℃
  • 二极管配置:独立式(单只稳压二极管)
  • 封装:SOD-323(适合表贴)

这些参数说明该型号在低电流工作点下具有较小的泄漏电流和可控的稳压特性,但功率承受能力属于小功率级别,应注意热耗散限制。

三、优势与特点

  • 体积小:SOD-323 封装适合高密度贴片 PCB 布局,利于小型化设计。
  • 低反向漏流:2 μA @ 2V 的反向电流有利于电池供电及待机功耗敏感的应用。
  • 稳压精度合理:5.0V~5.2V 的范围满足多数 5V 轨道的基准或保护需求。
  • 宽温工作:-40℃~125℃ 能够应对工业级温度变化。
  • 易于采购:标准封装与常见型号,便于批量贴装与自动化生产。

四、典型应用

  • 低功耗稳压参考(小电流基准)
  • 电源浪涌与过压保护(对小信号线或局部电源进行钳位)
  • 电平移位与偏置电路(在限流条件下提供稳定参考)
  • 移动设备、便携仪表、传感器前端等对体积和功耗敏感的应用场景

使用建议:作为分流式稳压器时,应在输入侧串联限流电阻,并按最大耗散功率计算稳压工作点与阻值,避免器件过热。

五、选型与注意事项

  • 功耗和热设计:Pd = 200 mW 为绝对最大额定值。实际应用中建议考虑热阻与环境温度进行必要的功率降额,避免长时间接近极限工作。
  • 工作电流范围:BZT52B 系列在较小电流下表现最佳;若需要更大电流或更低稳压阻抗,应选择功率更高的封装或型号。
  • 动态阻抗:Zzt 与 Zzk 值影响稳压线性与瞬态响应,设计时需结合负载变化评估输出波动。
  • 漏电与温漂:低电流工作时泄漏电流和温度系数会影响精度,关键应用建议依据完整数据手册评估温度漂移。
  • 贴装与焊接:SOD-323 为小型贴片器件,遵循厂家推荐的回流焊温度曲线与 ESD 防护规范,避免焊接损伤与静电击穿。

六、封装、可靠性与采购

SOD-323 小封装利于自动贴装与高密度布板。器件符合常见小功率稳压二极管的可靠性预期,仓储及搬运时应防潮防静电。采购时请确认完整料号(BZT52B5V1S)、供应商信息(华轩阳电子)及批次数据手册,以获得器件的完整曲线图、回流焊规范和可靠性试验报告。

如需在特定工作电流、温度或波动环境下使用,建议提供电路条件以便进一步计算稳压点、限流电阻值及热降额方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.