WMSIC Electronic Components

HXY MOSFET AON7264E-HXY

ModelAON7264E-HXY
PackageDFN3x3-8L
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET AON7264E-HXY
Type
HXY MOSFET
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
AON7264E-HXY
Electronic Component
1
Package
DFN3x3-8L
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
Electronic Component
Electronic Component
0.107g
Electronic Component
1
Electronic Component
BM0258661745
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
30W
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AON7264E-HXY 产品概述

一、概览

AON7264E-HXY 为华轩阳电子(HXY)推出的一款 N 沟场效应管(MOSFET),额定漏源电压 60V,连续漏极电流 40A,适用于中高电压开关与功率管理场合。封装为 DFN3x3-8L,小尺寸同时兼顾较好的导热性能,适合紧凑电源与车载辅助电路等应用。

二、主要参数

  • 类型:N 沟 MOSFET(单个)
  • Vdss(漏源电压):60V
  • Id(连续漏极电流):40A
  • RDS(on)(导通电阻):15mΩ @ Vgs=10V、Id=20A
  • Pd(耗散功率):30W
  • Vgs(th)(阈值电压):1.6V(典型)
  • Ciss(输入电容):930pF @ 25V
  • Crss(反向传输电容 / Miller):8pF @ 25V
  • 工作温度范围:-55℃ ~ +150℃
  • 封装:DFN3x3-8L

三、核心特性与优势

  • 低导通损耗:15mΩ 的 RDS(on) 在 10V 栅压下可显著降低导通损耗,适合高电流路径。
  • 适用 48V 及以下系统:60V 的耐压为常见48V总线、工业与通信供电提供裕量。
  • 中等开关损耗:Ciss≈930pF 表明门极电荷适中,驱动器需提供相应峰值电流;Crss=8pF 表现出较小的 Miller 效应,有利于降低开关过渡损耗与振铃。
  • 小型 DFN3x3 封装:占板面积小,利于高密度布局,并可通过底部散热焊盘与多盏通孔改善热性能。

四、典型应用场景

  • 同步降压转换器(Synchronous Buck)高侧或低侧开关
  • 48V 带电源管理、分布式供电系统
  • 电机驱动、无刷电机控制的功率级
  • 负载开关、电源故障保护与逆变器前级(需根据系统 PV 和 SOA 校核)

五、设计与热管理建议

  • 栅极驱动:为达到标称 RDS(on),建议采用 10V 的栅压驱动;1.6V 为阈值,仅表示导通起始电压,不应作为工作驱动电压。
  • 损耗估算(示例):在 20A 连续导通时,导通损耗约为 Pd_on = I^2·R = 20^2×0.015 = 6W(不含开关损耗),需配合良好散热设计。
  • PCB 布局:加强器件底部与散热铜箔的连接,采用多盏热沉通孔导出热量;缩短漏-源/栅到驱动器的走线,避免长走线导致寄生电感与振铃。
  • 保护与滤波:在感性负载与高 dv/dt 场合考虑并联 TVS、RC 吸收或栅极电阻与阻尼网络以抑制尖峰与振铃。

六、封装与焊接提示

DFN3x3-8L 小封装在回流焊中易实现良好连接,但需注意底部散热焊盘的焊膏印刷量与焊盘设计以避免虚焊或焊球不足。建议按 PCB 厂家与制程做试焊评估,并在高可靠性需求下加强热管理和应力释放设计。

七、结论与选型建议

AON7264E-HXY 适合追求小型化同时需承受较高电流与中等电压的功率开关场合。若系统驱动可提供 ~10V 栅压并能落实有效散热,这颗器件在导通损耗与开关性能之间提供良好平衡。选型时请结合系统的最大电流、开关频率、热设计和 SOA 要求做详细验证。若需在更高温度或车规级可靠性下使用,建议与供应商确认额外的合格与测试资料。

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