Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HXY MOSFET M7
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HXY MOSFET M7
- Type
- HXY MOSFET
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HXY MOSFET
- Electronic Component
- M7
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.099g
- Electronic Component
- 1
- Electronic Component
- BM0227691802
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 5uA@1kV
- (Vf)
- 1V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
M7 通用整流二极管（SMA 封装）产品概述
一、产品简介
M7 为独立式通用整流二极管，型号由 HXY MOSFET（华轩阳电子）生产，采用 SMA 表面贴装封装。器件额定整流电流为 1A，直流反向耐压 1000V，适用于高耐压、常规整流与保护场合。器件工作结温范围宽（-55℃～+150℃），适应性强，可靠性高。
二、主要电气参数
- 正向压降（Vf）：典型约 1.0V（1A 条件），最大可达到约 1.1V（视工艺差异）。
- 直流反向耐压（Vr）：1000V（1kV）。
- 反向电流（Ir）：约 5μA（在 Vr=1kV 时）。
- 平均整流电流：1A。
- 非重复峰值浪涌电流（Ifsm）：30A（单次浪涌能力）。
- 工作结温：-55℃～+150℃。
三、性能特点
- 高耐压：1000V 额定适合高压整流与电源输入保护。
- 低漏流：高耐压下反向漏流仍控制在微安级，利于高压电路稳定性。
- 良好冲击能力：30A 的峰值浪涌电流可应对开机浪涌与突发过载。
- 封装经济：SMA 外形便于自动贴装，适合批量生产和空间受限的 PCB 设计。
四、典型应用场景
- 开关电源输入整流、续流回路。
- 电机驱动与电源模块的保护二极管。
- 反向极性保护与高压整流电路。
- 家用电器、工业控制、照明驱动等需兼顾耐压与成本的场合。
五、选型与使用建议
- 若线路常态电流靠近 1A，建议考虑器件散热与焊盘铜箔加大，或选择额定电流更高的型号以延长寿命。
- 在高浪涌环境（如感性负载开关）下，评估 Ifsm 能否满足多次脉冲要求；必要时并用或选取更高冲击能力产品。
- 对正向压降敏感的低损耗电源，应关注 Vf 在工作电流下的实际值，或考虑肖特基类型替代（但需权衡耐压与漏流）。
六、封装与热管理
SMA 封装便于贴装，但对热散能力有限。建议设计时：
- 增大焊盘面积、采用散热铜箔和热铜柱；
- 对板上温度敏感点布局留出空气对流通道；
- 焊接时遵循制造商建议的回流曲线，避免过热导致封装或焊点损伤。
七、可靠性与品质控制
华轩阳电子的 M7 在常温与高温循坏、浪涌与耐压试验中表现稳定。建议在批量采购时索取样品做实测（Vf、Ir、Vr、Ifsm），并检查出厂静电防护、包装和标识，以便质量追溯。
总结：HXY MOSFET（华轩阳电子）M7 SMA 封装二极管以 1A/1000V 的耐压能力、微安级反向漏流与 30A 的浪涌承受力，提供了一款在高压整流与保护场合兼顾性能与成本的可靠选择。根据具体电路工作点做好散热和浪涌评估，可取得最佳使用效果。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
