Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HXY MOSFET B0520WS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HXY MOSFET B0520WS
- Type
- HXY MOSFET
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HXY MOSFET
- Electronic Component
- B0520WS
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.02g
- Electronic Component
- 1
- Electronic Component
- BM0265008964
- Current
- 350mA
- Diode
- Electronic Component
- Current(Ir)
- 5uA
- (Vf)
- 600mV@1A
- Electronic Component
- 40℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
B0520WS 产品概述
一、主要特点
B0520WS 为独立式肖特基整流二极管，适合小型电源与高频开关场景。主要特点包括：最大连续正向电流 IF = 0.35A、正向压降 VF 标称 0.6V（测试条件 1A）、静态反向漏电流 IR = 5μA、非重复峰值浪涌电流 IFSM = 1.5A、工作结温范围 -40℃ 至 +125℃。封装为 SOD-323，生产品牌为 HXY MOSFET（华轩阳电子）。
（注：在您提供的信息中出现对反向耐压 VR 的不同描述——有 20V 与 40V 两种值，请以厂家出具的正式规格书或样品铭牌为准。）
二、典型应用
- 小功率开关电源输出整流
- 高频开关电路中的快速整流与钳位
- 便携式电子产品与移动电源的小电流整流环节
- 二极管保护、电平方向隔离与反并联防反接场合
三、电气与热性能要点
- 正向压降：标注 VF = 0.6V@1A，说明在 1A 测试点有此压降；在典型工作电流 0.35A 下，实际 VF 会低于该值，有利于降低功耗。
- 漏电流与隔离：IR = 5μA（标准测试条件），表明在关断状态下漏电较小，适合需要较好隔离性的便携设备。
- 浪涌能力：IFSM = 1.5A，可承受短时冲击电流，但 SOD-323 小封装的耗散能力有限，频繁大浪涌或较长脉冲需谨慎。
- 温度与可靠性：工作结温 -40℃~+125℃，在高温工况下应考虑电流降额与散热设计以保证长期可靠性。
四、封装与机械特性
SOD-323 为超小型表贴封装，适用高密度 PCB 布局。优点是占板面积小、寄生电感低；缺点是散热能力有限，PCB 布局需靠近热源或增加铜箔以利散热。焊接时遵循厂家回流曲线以避免过热损伤。
五、选型建议与注意事项
- 确认反向耐压（VR）额定值：因资料中出现 20V 与 40V 两种描述，务必以样品或规格书为准，选择时应留有余量（通常取 1.5~2 倍工作电压）。
- 考虑温升与降额：在较高环境温度或持续高占空比下，应对 IF 做降额处理，避免超出封装散热能力。
- 浪涌与瞬态：IFSM 能承受短时浪涌，但若电路中存在较大浪涌能量（例如电感放电），建议并联更高浪涌能力器件或增加限流元件。
- PCB 布局：缩短电流回路、增大铜层面积以提升散热并降低导通损耗与热阻。
- 验证测试：在最终产品中进行温升、反向漏电随温度变化以及浪涌重复性测试，确保长期稳定性。
总结：B0520WS 以其小封装、低漏电与较低正向压降的特性，适合小功率整流与高频开关场合。选型时重点核实反向耐压并做好热管理与浪涌保护，以确保器件在目标工况下长期稳定可靠。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
