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HXY MOSFET SS24L
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HXY MOSFET SS24L
- Type
- HXY MOSFET
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HXY MOSFET
- Electronic Component
- SS24L
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0258661614
- Current
- 2A
- Diode
- Electronic Component
- Current(Ir)
- 100uA
- (Vf)
- 550mV@2A
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS24L 产品概述
一、产品简介
SS24L 为肖特基势垒二极管，品牌为 HXY MOSFET（华轩阳电子），采用 SOD-123FL 小型封装，专为空间受限且需要高效整流与快速开关的电子设备设计。器件具有低正向压降、低反向漏电与较强瞬态浪涌能力，适用于电源管理和保护电路。
二、主要性能参数
- 最大连续正向电流（IF）：2 A
- 反向耐压（VR）：40 V
- 典型正向压降（VF）：0.55 V @ 2 A
- 反向漏电流（IR）：≤100 μA（室温）
- 瞬时正向浪涌电流（IFSM）：峰值可达 50 A
- 工作结温范围：-65 ℃ ～ +150 ℃
三、封装与热性能
SS24L 采用 SOD-123FL 封装，体积小、焊接可靠，适合表面贴装工艺。小封装在热阻上不及大功率封装，建议在电流接近额定值或高温环境下通过增加 PCB 铜箔面积或热焊盘优化散热，必要时并联导热对策以保证长期稳定。
四、典型应用场景
- 开关电源整流（降压/升压整流）
- 电源输入极性保护与反接保护
- 快速恢复与续流二极管（例如同步整流旁路）
- 便携式设备、充电器、适配器及工业控制电源等场合
五、使用建议与注意事项
- 在实际应用中应考虑温度对正向压降与漏电流的影响，高温时建议对额定电流进行降额处理以延长寿命。
- 焊接时遵循封装的回流焊工艺规范，避免超温或超时，防止封装应力及焊点劣化。
- 设计 PCB 布局时为热流路径留出足够铜厚与焊盘面积，并尽量缩短对地/电源回流路径以降低电阻与热集中。
- 注意静电防护与储存环境，长时间高湿或高温存放会影响可靠性。
六、可靠性与采购信息
SS24L 经工艺优化以保证重复一致的电气性能与焊接可靠性，适配多种自动化贴装生产线。订购型号：SS24L（SOD-123FL，HXY MOSFET/华轩阳电子）。如需样品、批量价格或完整数据手册与封装尺寸图，请联系供应商或经销渠道获取详细资料与测试曲线，以便完成最终设计验证。
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