WMSIC Electronic Components

HXY MOSFET BAT54WS

ModelBAT54WS
PackageSOD-323
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET BAT54WS
Type
HXY MOSFET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
BAT54WS
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0257710629
Current
200mA
Diode
1
Current(Ir)
2uA@25V
(Vf)
800mV@100mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAT54WS 产品概述

一、产品简介

BAT54WS 是一款面向低压、低功耗应用的肖特基整流二极管(双二极管封装),由 HXY MOSFET(华轩阳电子)提供,采用 SOD‑323 小型封装。该器件以低正向压降与较小反向漏电流为特点,适用于便携设备、信号整流与浪涌钳位等对体积和响应速度有要求的电路。

二、主要电气参数

  • 正向压降 (Vf):0.8 V @ 100 mA
  • 直流反向耐压 (Vr):30 V
  • 连续整流电流:200 mA
  • 反向电流 (Ir):2 µA @ 25 V
  • 非重复峰值浪涌电流 (Ifsm):600 mA
    这些参数表明器件可承受较小直流负载并能忍受短时浪涌,但受限于封装热阻,长时间大电流工作需注意热设计。

三、典型应用场景

  • 电源极性保护与反接防护(低电流场合)
  • 低压整流与二极管钳位电路
  • 信号整流与路径选择(steering diodes)
  • 快速恢复/开关抑制场合(替代标准硅二极管以减少响应延迟)
  • 移位器、检测电路及电平转换辅助件

四、封装与 PCB 注意事项

SOD‑323 为超小型封装,适合空间受限的表面贴装板。布板时建议:

  • 尽量缩短走线和减小串联电阻以降低发热与压降。
  • 高频或开关场合在二极管输入/输出处添加适当旁路/缓冲元件,减少电磁干扰。
  • 封装热阻较大,若长期接近200 mA 工作,应预留散热通道或降低实际工作电流以防过热。

五、选型与替代

BAT54WS 适合偏向体积小、响应快且反向漏电较低的场景。选择器件时应对比正向压降、最大反向电压与浪涌能力,确保满足实际工况。BAT54 系列有多种衍生型号(如单管、共阴/共阳封装等),在需要更大电流或更低 Vf 时可考虑同类更高规格的肖特基器件。

六、存储与焊接建议

  • 遵循元器件湿敏等级(MSL)控制,必要时回流前回烤除湿。
  • 防静电保护(ESD)与正确的回流温度曲线有助于提升良率与可靠性。
  • 产线上应控制回流温度峰值与时间,避免超出 SOD‑323 的工艺限制。

如需完整电气特性曲线、引脚排列或应用电路图,请索取 HXY MOSFET(华轩阳电子)官方数据手册与样片,以便在具体设计中验证热性能与寿命曲线。

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