WMSIC Electronic Components

HXY MOSFET BV03C

ModelBV03C
PackageSOD-323
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET BV03C
Type
HXY MOSFET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
BV03C
Electronic Component
1
Package
SOD-323
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.03g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
1pF
Electronic Component
BM0257710908
Operating Temperature
40℃~+125℃
Voltage
20V
Electronic Component
IEC 61000-4-5;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BV03C 产品概述

一 产品简介

BV03C 是华轩阳电子(HXY MOSFET)推出的一款单路双向瞬态抑制器(ESD/浪涌保护器件),封装为 SOD-323。器件针对 3.3V 工作电压系统优化,兼顾高速信号保护与瞬态能量吸收能力,适用于接口保护与电路板局部防护方案。

二 主要参数与特性

  • 极性:双向
  • 反向截止电压(Vrwm):3.3V(适配 3.3V 系统)
  • 击穿电压(Vbr):5.4V(典型)
  • 钳位电压:20V(峰值脉冲时)
  • 峰值脉冲电流(Ipp):20A
  • 峰值脉冲功率(Ppp):400W(8/20µs 波形)
  • 反向漏电流(Ir):1µA(常温、Vrwm 条件下)
  • 结电容(Cj):1pF(低电容,适合高速信号)
  • 通道数:单路(单通道保护)
  • 工作温度:-40℃ ~ +125℃
  • 防护等级:符合 IEC 61000-4-5(浪涌)与 IEC 61000-4-2(ESD)

三 电气性能解析

BV03C 在静态条件下于 3.3V 以内保持极低漏电(Ir≈1µA),不会对敏感电路造成明显静态负担。遭受瞬态冲击时,器件在击穿区将快速导通,将高能量脉冲限制在约 20V 钳位电压,单次 8/20µs 波形下可承受 400W 峰值功率与 20A 峰值电流,能有效吸收来自接插件、外部线缆的高幅值短时干扰。

1pF 的低结电容使 BV03C 适用于对信号完整性要求较高的串行/差分信号线(如 3.3V TTL、LVDS 等),对高速链路的影响最小。

四 封装与可靠性

SOD-323 小外形便于高密度 PCB 布局,适合移动设备、消费电子与工业接口保护。器件工作温度覆盖 -40℃ 至 +125℃,并通过 IEC 相关标准验证,可靠性满足一般工业级应用需求。

五 典型应用场景

  • 3.3V 电源与信号线的 ESD/浪涌保护
  • 接口防护:UART、I2C、SPI、GPIO 等外部引脚保护
  • 通信与数据链路的端口保护(需低电容特性)
  • 工业控制与终端设备的局部浪涌抑制

六 选型与使用建议

  • 若保护对象为单端且工作电压为 3.3V,BV03C 为合适选择;若为较高工作电压系统,应选用 Vrwm 匹配的器件。
  • 在高重复脉冲或大能量环境中,考虑并联更大功率的保护器件或采用多级防护以分担能量。
  • 低结电容有利于高速信号,但在差分接口上需注意阻抗配合与布局一致性。

七 PCB 布局与安装要点

  • 将 BV03C 尽量靠近受保护的连接器或引脚放置,减小引线环路面积,缩短到地的回流路径。
  • 对地端应采用低阻抗、大面积的接地平面,并使用短粗的过孔连接,以提高瞬态能量散逸能力。
  • 若与其它保护元件并用,遵循从前端到后端逐级能量分散的原则,避免单点过载。

八 总结

BV03C 是一款面向 3.3V 系统的双向低电容瞬态抑制器,兼顾高速信号兼容性与较高的脉冲能量吸收能力。小型 SOD-323 封装适合密集布局与多场景防护需求,是接口与局部电路防护的实用器件。选型时应结合实际脉冲环境与重复能力需求进行系统评估。

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