WMSIC Electronic Components

HXY MOSFET BAS16

ModelBAS16
PackageSOT-23
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET BAS16
Type
HXY MOSFET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
BAS16
Electronic Component
1
Package
SOT-23
Electronic Component
Switch Diode
Electronic Component
0.041g
Electronic Component
1
Electronic Component
BM0227249380
Current
150mA
Diode
Electronic Component
Current(Ir)
1uA@75V
(Vf)
1.25V@150mA
Power Dissipation(Pd)
225mW
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAS16 产品概述

一、产品简介

BAS16 是一款独立式开关二极管,由 HXY MOSFET(华轩阳电子)提供,采用 SOT-23 小型封装,面向高速开关和保护电路应用。器件具有较低的正向压降与快速的反向恢复特性,适合在开关、整流、夹位和信号整形等场合替代通用硅开关二极管。

二、主要电气参数

  • 正向压降 (Vf):1.25V @ If = 150mA
  • 最大直流反向耐压 (Vr):75V
  • 连续整流电流:150mA
  • 峰值非重复浪涌电流 (Ifsm):2A
  • 反向恢复时间 (Trr):6ns(快速恢复,适合高速开关)
  • 反向漏电流 (Ir):1µA @ Vr = 75V
  • 耗散功率 (Pd):225mW
  • 工作结温范围:-55℃ ~ +150℃

以上参数在典型工作条件下体现器件的基本能力,具体应用时请参考器件完整数据表以获得更多测试条件与曲线。

三、关键特性与优势

  • 快速开关:6ns 的反向恢复时间使其在高频开关或脉冲应用中具有较低的开关损耗与干扰。
  • 低漏电:在最大反向电压下反向电流仅约 1µA,便于高阻抗或高压回路的稳定性要求。
  • 小型封装:SOT-23 便于紧凑 PCB 布局与自动贴装,适合便携与密集电路板。
  • 容易并用:150mA 的连续电流与 2A 的浪涌能力能承受短时电流峰值,适配多数信号与小功率负载。

四、典型应用场景

  • 开关电源中的快速钳位与整流
  • 信号整形、脉冲限幅与保护电路
  • 逻辑电平隔离、反向保护与防止反向电流
  • 高频小功率变换与混频电路中作保护或导通元件

五、封装与热管理

BAS16 封装为 SOT-23,便于 SMT 生产。由于单片耗散功率为 225mW,设计时应注意 PCB 的散热路径与铜箔面积,以降低结温并延长寿命。在高环境温度或持续较大正向电流条件下,建议采用退额(derating)设计,保证工作结温低于额定上限。

六、选型与使用建议

  • 余量设计:在选择时建议将正向电流与耗散功率留出余量,避免器件长期工作在临界值。
  • 开关速度:若应用对开关损耗或交叉导通干扰敏感,Trr = 6ns 为参考值,但应在目标电路中测量实际开关波形。
  • PCB 布局:将二极管的焊盘与散热铜箔连接良好,缩短回流路径,减少寄生电感以降低开关振铃。
  • 焊接与存储:遵循厂商的贴片与焊接规范进行回流焊;长期存储请按湿敏等级与环境防潮要求处理。

结语:BAS16 以其快速恢复、低漏电和小巧封装,适合多种中低功率、高速开关与保护用途。实际设计时请以 HXY MOSFET 的完整数据手册为准,结合系统工况进行电气与热设计验证。

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