WMSIC Electronic Components

HXY MOSFET SS510B

ModelSS510B
PackageSMB
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET SS510B
Type
HXY MOSFET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
SS510B
Electronic Component
1
Package
SMB
Electronic Component
Schottky Diode
Electronic Component
0.128g
Electronic Component
1
Electronic Component
BM0257710732
Current
5A
Diode
Electronic Component
Current(Ir)
100uA
(Vf)
850mV@5A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS510B — 肖特基二极管(SMB 封装)产品概述

一、产品简介

SS510B 为华轩阳电子(HXY MOSFET)提供的一款独立式肖特基整流二极管,采用SMB(DO-214AA)封装,针对中大电流整流、续流保护和快速恢复场合设计。肖特基结构保证低正向压降和快速开关特性,适用于对效率和响应速度有较高要求的电源前端与功率路径保护。

二、主要参数

  • 二极管类型:肖特基(独立式)
  • 正向压降(Vf):850 mV @ 5 A
  • 直流反向耐压(Vr):100 V
  • 额定整流电流(Io):5 A
  • 反向电流(Ir):100 µA(典型/最大值请参考具体温度条件)
  • 非重复峰值浪涌电流(Ifsm):150 A(单次脉冲)
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SMB(表面贴装/带散热能力)

三、关键特性与优势

  • 低正向压降:850 mV @5 A 可明显降低整流损耗,提高系统效率,尤其在开关电源和降压转换器中能有效减少热量产生。
  • 快速恢复与低反向恢复电荷:肖特基结构天然具备快速响应,适合高频开关场合,减少开关损失与电磁干扰。
  • 良好的浪涌能力:150 A 的单次峰值浪涌能力能承受启动/短时过载脉冲,增强系统可靠性。
  • 宽工作温度:-55~+150 ℃ 满足严苛环境与高温工作的需求。

四、封装与热管理

SMB 封装在保证机械强度和散热路径的同时,便于表面贴装自动化生产。实际应用中建议:

  • 在PCB上为二极管焊盘提供足够的铜面积或热过孔,以降低结到环境的热阻。
  • 对于持续接近额定电流工作的场景,应进行功耗计算并适当降额使用或增加散热装置。
  • 浪涌和高温会显著增加反向泄漏,应在热设计中考虑最差工况。

五、典型应用场景

  • 开关电源整流与续流二极管
  • DC-DC 转换器输出整流
  • 逆向保护与低压降电源路径切换
  • 汽车电子、通信设备和工业电源中对效率及响应速度有要求的场合
  • 电池充放电管理与快速充电器线路

六、安装与使用注意事项

  • 遵循厂家推荐的回流焊工艺曲线,避免长时间高温导致封装和结温损伤。
  • 在高温环境或高反向电压条件下,注意反向漏电随温度上升而增加,必要时选用更高耐压或更低漏电的器件。
  • 若系统存在重复浪涌,请评估器件的热冲击与寿命,必要时采用冗余或更高规格器件。

七、可靠性与测试建议

  • 在设计阶段进行热仿真与实际测温验证,确保结温在允许范围内。
  • 建议做电气应力测试(过压、突波、浪涌)和高低温循环测试以验证在目标工况下的长期稳定性。
  • 对于批量采购,可要求供应商提供测试报告和材料合规证明(如RoHS),并关注批次一致性。

总结:SS510B(SMB)凭借低压降、快速响应与良好浪涌能力,是电源整流与保护的实用选择。合理的热设计和正确的使用规范能最大化发挥其性能与寿命。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.