WMSIC Electronic Components

HXY MOSFET S9015

ModelS9015
PackageSOT-23
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET S9015
Type
HXY MOSFET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
S9015
Electronic Component
1
Package
SOT-23
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0258661897
Transistor Type
PNP
Frequency(f T)
150MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
100mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S9015 产品概述

一、产品简介

S9015 是华轩阳电子(HXY MOSFET)推出的一款小功率 PNP 双极晶体管,采用 SOT-23 封装,面向便携式电子、信号放大与高侧开关等应用场景。器件在低电流工作点下具有很高的直流电流增益,兼顾较好的频率特性和低泄漏特性,适合对体积、成本和频响有要求的消费类与工业类产品。

二、主要技术参数

  • 晶体管类型:PNP
  • 最大集电极电流 Ic:100 mA
  • 集电极—射极击穿电压 Vceo:45 V
  • 最大耗散功率 Pd:200 mW(SOT-23,环境温度和电路热设计影响实际功耗)
  • 直流电流增益 hFE:300 @ Ic=1 mA, Vce=5 V(低电流高增益)
  • 特征频率 fT:150 MHz(适用于高频小信号放大)
  • 集电极截止电流 Icbo:100 nA(低泄漏)
  • 集电极—射极饱和电压 VCE(sat):300 mV(在饱和状态下压降小)
  • 射极—基极反向击穿 Vebo:5 V
  • 封装:SOT-23
  • 品牌:HXY MOSFET(华轩阳电子)

三、性能特点与优势

  • 高增益:在小电流(≈1 mA)工作点 hFE 高达 300,适合低功耗前置放大器与电平转换。
  • 高频性能良好:fT = 150 MHz,能够支持宽带、小信号放大与高频开关应用。
  • 低泄漏:Icbo 仅 100 nA,有利于静态功耗受限的电路或高阻抗输入场合。
  • 低饱和压降:VCE(sat) ≈ 300 mV,有助于在开关应用中降低功耗和热量产生。
  • 小外形:SOT-23 封装便于表面贴装,节省 PCB 面积,适合批量装配。

四、典型应用场景

  • 便携式设备的音频前置放大、传感器信号放大。
  • 单电源系统中的高侧开关与电平转换(因其为 PNP,适合正极侧控制场合)。
  • 通用小信号开关:驱动继电器、LED 或作为电流镜的分流元件。
  • 高频小信号放大器与缓冲级,适用于无线或通信终端的某些前端电路。

五、使用建议与注意事项

  • 工作极限:实际使用时请务必留出裕量,避免长时间在接近 Ic、Vceo 或 Pd 的条件下工作。SOT-23 的 Pd 受环境温度与 PCB 散热影响较大,需做热设计与降额(详见厂家热参数与温度系数)。
  • 饱和导通驱动:若用于开关并需进入饱和区,基极驱动电流应足够(实际饱和 hFE 远低于直流 hFE)。常规经验在大电流切换时采用较大的基极电流以保证低 VCE(sat)。
  • 反向基极电压:避免使 BE 反向电压超过 Vebo = 5 V,否则可能损伤结。
  • PCB 布局:SOT-23 应采用短引线、加大散热铜箔或加热沉处理,提高持续功率能力。对于高频应用,应注意地线回流与走线阻抗控制。
  • 引脚定义与电气连接请以华轩阳电子数据手册为准,生产批次与封装标识请核对。

S9015 以其高 hFE、良好频率响应与小封装,适合在体积受限且对低电平信号处理要求较高的电路中替代传统中低频三极管。选型与电路设计时,请参考完整数据手册及热设计指南以确保长期可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.