WMSIC Electronic Components

HXY MOSFET 1N4007

Model1N4007
PackageSMA
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET 1N4007
Type
HXY MOSFET
Minimum package
5000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
1N4007
Electronic Component
1
Package
SMA
Electronic Component
General Purpose Diode
Electronic Component
0.081g
Electronic Component
1
Electronic Component
BM0257710777
Current
1A
Diode
Electronic Component
Current(Ir)
5uA@1000V
(Vf)
1V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1N4007 产品概述

一、概述

1N4007 是广泛使用的通用整流二极管,适用于交流整流、直流电源保护、反向电压钳位等场合。由华轩阳电子(HXY MOSFET)提供的该型号为独立式器件,封装为 SMA,适合表面贴装或手工焊接应用。器件耐压高、额定整流电流为 1A,适合中小功率整流和保护用途。

二、主要电气参数

  • 直流反向耐压 Vr:1000 V(最大额定反向电压,可承受高电压工况)
  • 正向压降 Vf:约 1.1 V(在额定整流电流附近测得的典型值,随电流变化)
  • 正向整流电流 If:1 A(连续工作条件下的额定电流)
  • 反向电流 Ir:5 μA(常温下的漏电流,温度升高时会显著增加)
  • 非重复峰值浪涌电流 Ifsm:30 A(短时浪涌、电源启动或故障条件下的冲击承受能力)
  • 工作结温范围:-55 ℃ ~ +150 ℃(宽温度范围,适合工业环境)

三、特点与优势

  • 耐压能力强:1000 V 反向耐压使其在高电压整流与防反接场合更可靠。
  • 通用性高:适合整流、钳位、反相保护、续流等多种电路需求。
  • 抗浪涌能力:30 A 的非重复峰值浪涌电流可应对短时启动和冲击电流。
  • 宽温工作:-55 ℃ 至 +150 ℃ 的结温范围满足严苛环境要求。
  • 封装适应性:SMA 封装便于表面贴装与自动化生产。

四、典型应用

  • 交流电整流与滤波(低到中功率电源)
  • 反向电压保护与整流桥(高压耐受场合)
  • 电机启动回路、继电器钳位与浪涌抑制
  • 工业控制、电源模块、家用电器等场合的通用保护元件

五、选型与使用建议

  • 考虑开关频率:1N4007 属于通用整流器件,恢复时间较长,不建议用于高频开关电源或高速脉冲应用;高频场合应选用快恢复或肖特基二极管。
  • 热管理:在 If=1A 持续工作时需关注结温及封装散热,必要时在 PCB 上增加铜箔散热或使用散热结构。
  • 漏电流随温度上升:反向漏电流 Ir 在高温下会显著增加,设计应留有裕量,避免在高温+高压下出现过大泄漏。
  • 浪涌次数限制:Ifsm 为非重复峰值,频繁的大浪涌会降低寿命,应避免重复超过器件应力范围的冲击。
  • 安全裕量:在高可靠性设计中,建议电压、温度和电流均按一定裕量降额使用。

六、封装与焊接注意

SMA 封装适合回流焊和手工焊接。焊接时应避免长时间高温加热以防封装损伤或引脚氧化;推荐按制造商的回流曲线进行焊接。器件与 PCB 间保持良好热路径,有助于降低结温并延长寿命。

七、储存与可靠性

请在干燥、常温、避光环境中保存,避免潮湿及机械应力。长期储存或在高温高湿环境下可能影响焊接性能与电气参数。出货与检验时建议按 IPC/JEDEC 或厂商提供的测试条件进行外观和参数抽检。

总结:HXY MOSFET(华轩阳电子)出品的 SMA 封装 1N4007 以其高耐压、良好的浪涌能力和宽温工作范围,适用于多数中低频整流与保护场合。选用时注意热管理、频率和反向漏电随温度变化等因素,以确保电路长期可靠运行。

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