WMSIC Electronic Components

HXY MOSFET PC817B

ModelPC817B
PackageSMD-4P
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET PC817B
Type
HXY MOSFET
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
PC817B
Electronic Component
1
Package
SMD-4P
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.411g
Electronic Component
1
Electronic Component
5us
Electronic Component
BM0219903677
Operating Temperature
55℃~+110℃
Load Voltage
35V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
Output Channel Count
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PC817B 产品概述

一、产品背景

在现代电子设备中,信号的隔离与传输是实现安全、稳定和高效工作的关键技术之一。光耦合器(光隔离器)作为一种重要的电子组件,广泛应用于工业控制、通信和医疗设备等领域。PC817B是一种广泛应用的光耦合器,其设计与应用展示了光电隔离技术的优势。PC817B的核心组件是光电三极管,该三极管能够以较低的工作电压和电流,实现较高的信号传输效率。

二、产品特点

PC817B由光电发射器和光电接收器组成,其中发射器通常为发光二极管(LED),接收器为光电三极管。下面列举了该产品的一些重要特性:

  1. 高隔离电压:PC817B提供高达5000Vrms的隔离电压,确保数字信号和高电压部分之间的安全隔离,有效防止了电流意外流入敏感电路,保护下游设备。

  2. 输出电流能力:该光耦输出光电三极管可承受最高50mA的输出电流,适用于各种负载情况,确保其在不同应用场景下的可靠性与稳定性。

  3. 低输入电压:其输入端工作电压一般为1.2V,这使得PC817B在低功耗电路中表现优异,符合当前对节能元件的需求。

  4. 便捷封装:采用SMD-4封装,方便自动焊接,适合高密度的PCB设计,有效提升了组装效率和生产效率。

  5. 工作温度范围:PC817B可在宽广的温度范围内工作,通常为-40°C到+85°C,确保了在恶劣环境下的可靠性和稳定性。

三、应用领域

由于其优异的性能,PC817B广泛应用于多个领域,包括但不限于:

  1. 工业控制:在PLC控制系统中,PC817B可用于数字信号传输与电气隔离,保护控制电路与高压电源之间的安全。

  2. 通信设备:用于数据传输和设备间隔离,PC817B能够有效降低电磁干扰,为信号复原提供安全保障。

  3. 开关电源:光耦可用于开关电源的反馈回路中,帮助实现输出电压的稳压、稳定性和开关控制的真正隔离。

  4. 医疗设备:在生物医疗设备中,PC817B能够确保信号传输的安全防护,保护患者和设备的安全。

  5. 家用电器:在各种智能家居设备中,PC817B用于开关和传感器的信号传输,提升了设备的智能化程度。

四、总结

PC817B光耦合器以其卓越的性能、低功耗和高隔离电压,成为电子设计中不可或缺的元器件之一。其适应性广、使用方便,能够满足当今快速发展的电子产品需求。PC817B凭借其在通信、工业控制和医疗设备中的多样化应用,展现了光电隔离技术在提升设备安全性和可靠性方面的重要性。无论是在新产品的研发还是在现有产品的升级中,PC817B都是设计工程师值得信赖的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.