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HXY MOSFET BAT54S
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HXY MOSFET BAT54S
- Type
- HXY MOSFET
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HXY MOSFET
- Electronic Component
- BAT54S
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0257710780
- Current
- 100mA
- Diode
- 1
- Current(Ir)
- 2uA@25V
- (Vf)
- 1V@100mA
- Electronic Component
- 40℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT54S 肖特基二极管（华轩阳电子 HXY MOSFET）产品概述
一、产品简介
BAT54S 为华轩阳电子（HXY MOSFET）推出的一款小型肖特基整流二极管，采用 SOT-23 封装，内部为 1 对串联连接。器件针对低压快速整流与反向保护场合优化，具有低正向压降、快速开关特性和良好的浪涌承受能力，适合便携电源、逻辑电平接口保护及电路电源管理等应用。
二、主要电气参数
- 二极管配置：1 对串联式
- 正向压降（Vf）：1.0 V @ 100 mA
- 直流反向耐压（Vr）：30 V
- 连续整流电流（If）：100 mA
- 反向漏电流（Ir）：2 μA @ 25 V
- 非重复峰值浪涌电流（Ifsm）：600 mA
- 工作结温范围：-40 ℃ ～ +125 ℃
三、典型应用场景
- 低压整流：用于小功率开关电源或二次侧整流，适合 100 mA 量级的电流需求。
- 电源路径选择/反相保护：串联配置有利于实现反向电压安全保护及电源反接防护。
- 快速钳位与隔离：肖特基器件的快速恢复特性适用于高频切换电路的钳位或隔离应用。
- 便携与消费类电子：体积小、封装紧凑，适合手机配件、耳机、无线设备等空间受限场合。
四、封装与热管理
SOT-23 封装体积小，便于表面贴装和自动化生产。由于封装的散热能力有限，器件在接近额定连续电流工作时应注意热量积聚，建议在 PCB 走线处加大铜箔面积或设置散热垫以降低结温。在高环境温度或长期满载工作时，应考虑降额使用以延长可靠性。
五、使用建议与注意事项
- 若电路存在长期大电流或反复浪涌，应确保最大连续电流不超过 100 mA，并考虑浪涌保护电路。
- 反向漏电流会随着温度升高而增加，对精密低漏电应用需评估温漂影响。
- PCB 布局时应优化电流回路与散热路径，避免在高功率器件附近叠加热源。
- 焊接工艺遵循 SOT-23 常规回流温度曲线，避免超过器件最大结温规格。
六、型号与采购
型号：BAT54S（华轩阳电子 HXY MOSFET）
封装：SOT-23
适用于需要低 Vf、快速响应且空间受限的中低功率电路。如需批量采购或索取详细数据手册，请联系供应商或查看华轩阳电子提供的器件规格书与封装图。
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