WMSIC Electronic Components

HXY MOSFET ZMM18V

ModelZMM18V
PackageLL-34
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET ZMM18V
Type
HXY MOSFET
Minimum package
2500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
ZMM18V
Electronic Component
1
Package
LL-34
Electronic Component
Zener Diode
Electronic Component
0.045g
Electronic Component
1
(Zzk)
170Ω
(Zzt)
50Ω
Electronic Component
BM0257710730
Diode
1
Current(Ir)
100nA@13V
Power Dissipation(Pd)
500mW
Electronic Component
16.8V~19.1V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZMM18V 稳压二极管(LL-34)产品概述

一、概述

ZMM18V 是华轩阳电子(HXY MOSFET)推出的一款独立式稳压二极管,标称稳压值为 18V,实际稳压范围为 16.8V~19.1V。器件采用 LL-34 小型轴向封装,适合在体积受限且需稳定参考电压或做低功耗稳压的场合使用。该器件反向漏电流极低,静态功耗小,便于在精密低电流电路中作为基准或保护元件。

二、主要技术参数

  • 类型:独立式稳压二极管(Zener)
  • 标称稳压:18V
  • 稳压范围:16.8V ~ 19.1V
  • 反向漏电流 Ir:100 nA @ 13V(典型测试点)
  • 动态阻抗 Zzt:50 Ω(在规定测试电流下)
  • 阶跃阻抗 Zzk:170 Ω(在拐点区域测试)
  • 最大耗散功率 Pd:500 mW(环境温度 25°C 时)
  • 封装:LL-34(轴向小玻璃封装)

三、特性与优点

  • 低漏电流:Ir 仅 100 nA 量级,有利于提高低电流电路的精度和稳定性。
  • 良好稳压特性:Zzt 值较低(50 Ω),在规定工作电流下提供较小的电压波动。
  • 小型封装:LL-34 便于手工焊接与自动贴装,适合空间受限设计。
  • 低功耗方案:Pd 为 500 mW,适合做微功耗稳压或参考源,注意功率限值以避免过热。

计算提示:理论上器件允许的最大稳态电流约为 Imax ≈ Pd / Vz = 0.5 W / 18 V ≈ 27.8 mA。为保证良好可靠性和热余量,推荐工作电流显著低于此值(例如 ≤ 20 mA 甚至更低,视散热条件而定)。

四、典型应用

  • 稳压参考源:作为 18V 参考电压,用于模拟电路、传感器供电或比较器参考。
  • 过压/钳位保护:在输入过压或瞬态情况下对后级电路进行限幅保护。
  • 偏置电路:为晶体管、放大器或运放提供稳定偏置电压。
  • 低功耗电子设备和便携设备中需要小电流高稳定度的场合。

示例(简述):在 Vin=24V,需稳定输出 18V 且负载电流 5 mA 的场合,选择分流电阻 R = (Vin − Vz) / (Iz + Iload),并确保 Iz + Iload 不超过器件允许的散热电流。

五、使用与注意事项

  • 功率限值:500 mW 为器件最大耗散,环境温度升高时需按厂商给出的温度特性做降额,避免长期接近额定功耗。
  • 漏电随电压变化:Ir 在更高反向电压下会增加,若在 18V 条件下要求极低漏电,应在系统设计时预留裕量。
  • 热管理:轴向 LL-34 封装散热能力有限,必要时在 PCB 布局上增加散热区域或限制功耗。
  • 焊接工艺:遵循无铅/有铅焊接温度曲线,避免过长高温暴露导致封装损伤。
  • 极性识别:安装时注意阴阳极方向,错误连接会导致器件不能稳压或损坏。

六、封装与标识

ZMM18V 采用 LL-34 轴向封装,外观为小型玻璃/环氧轴向管状体,封装上通常印有型号或品牌代码(HXY 标识)。出厂常见为卷装或托盘包装,具体包装、出货与样品信息请向供应商确认。

总结:ZMM18V 以其 18V 稳压值、低漏电流和小型 LL-34 封装特点,适合用于需要中高电压基准且电流不大的稳压和保护场合。在设计过程中应重视功耗限值和热管理,以保证长期可靠运行。若需更详细的温度特性曲线、测试电流条件和典型电压-电流特性曲线,建议参考厂方完整数据手册或联系华轩阳电子技术支持。

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