WMSIC Electronic Components

HXY MOSFET ICM-42688P-HXY

ModelICM-42688P-HXY
PackageLGA-14(2.5x3)
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET ICM-42688P-HXY
Type
HXY MOSFET
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
ICM-42688P-HXY
Electronic Component
1
Package
LGA-14(2.5x3)
Electronic Component
IMU Sensor / Gyroscope
Electronic Component
0.108g
Electronic Component
1
Features
Synchronous and
Electronic Component
BM0257677119
Operating Temperature
40℃~+85℃
Operating Voltage
1.71V~3.6V
Current
4uA
Interface Type
I2C;SPI
Output
16bit
Sensor Type
IMU

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ICM-42688P-HXY 产品概述

一、产品简介

ICM-42688P-HXY 是华轩阳电子(HXY MOSFET)供应的一款高性能 6 轴 MEMS 惯性测量单元(IMU),集成三轴加速度计和三轴陀螺仪。器件提供高达 ±16g 的加速度量程和 ±2000 dps 的陀螺仪量程,16bit 输出分辨率,支持 I2C 与 SPI 两种数字接口。工作电压范围宽(1.71V–3.6V),并且具有极低的待机电流(4 μA),适合电池供电和移动平台的姿态与运动检测应用。

二、主要特性

  • 6 轴传感:三轴加速度计(X、Y、Z)与三轴陀螺仪(X、Y、Z)。
  • 量程:加速度计最大量程 ±16g;陀螺仪最大量程 ±2000 dps。
  • 输出分辨率:16 bit,满足常见姿态解算与运动检测精度要求。
  • 接口类型:I2C 与 SPI(可选),便于与 MCU、FPGA 等主控器连接。
  • 低功耗:待机电流典型 4 μA,适合低功耗设计。
  • 电源:工作电压 1.71 V 至 3.6 V,兼容多种电源域与电池系统。
  • 工作温度:-40 ℃ ~ +85 ℃,满足工业级温度范围要求。
  • 封装:LGA-14(2.5 × 3 mm),小尺寸利于空间受限的终端产品设计。

三、技术参数概览

  • 传感器类型:惯性测量单元(IMU,6DoF)
  • 加速度计轴向:X、Y、Z
  • 加速度计量程(最大):±16g
  • 陀螺仪轴向:X、Y、Z
  • 陀螺仪量程(最大):±2000 dps
  • 输出位数:16 bit
  • 接口类型:I2C / SPI
  • 工作电压:1.71 V – 3.6 V
  • 待机电流:4 μA
  • 工作温度:-40 ℃ – +85 ℃
  • 品牌:HXY MOSFET(华轩阳电子)
  • 封装:LGA-14(2.5 × 3 mm)

(注:以上为主要参数概览,具体寄存器配置、滤波与时序等请参见器件技术资料。)

四、典型应用场景

  • 手持设备与可穿戴设备:姿态估计、步态检测、跌倒检测等。
  • 无人平台:无人机姿态控制、飞行稳定、惯性导航辅助。
  • 运动与健康监测:运动捕捉、步数统计、活动识别。
  • 消费电子与工业控制:陀螺稳定、倾斜补偿、振动监测。
  • 机器人与自动化:里程计融合、姿态估计、惯性辅助定位。

五、设计与使用建议

  • 电源与去耦:在 VDD 引脚附近放置 0.1 μF 陶瓷去耦电容,必要时并联 1 μF 以改善低频纹波抑制,保持电源稳压与纹波低。
  • 接地与布局:器件应放在 PCB 的实心接地平面上以减少噪声耦合;模拟地与数字地在板级上合理分区并在电源入口处合并。
  • 信号线走线:I2C/SPI 总线走线尽量短且避免与高速时钟线并行,以降低干扰。SPI 推荐使用模式与时序与主控端匹配。
  • 机械安装:器件坐标系须与 PCB 参考标识一致,安装处避免直接机械应力或焊接应力影响器件校准;建议在最终产品中做静态与动态校准以消除装配偏差。
  • 功耗管理:利用器件的待机/睡眠模式切换以降低系统平均功耗;在长待机场景下,可采用外部中断或定时唤醒策略。
  • 校准与滤波:系统级使用自适应滤波或传感器融合算法(如扩展卡尔曼滤波或互补滤波)来减小噪声与偏置;定期做温度相关的偏置补偿提高长期稳定性。
  • 数据速率与带宽:根据应用选择合适的采样率与数字低通滤波平衡延迟与噪声,确保运动细节与系统处理能力匹配。

六、封装与可靠性

ICM-42688P-HXY 采用 LGA-14 小型封装(2.5 × 3 mm),便于紧凑型 PCB 布局。器件在工业温度范围内工作,适合多数消费、工业与移动应用场景。建议在生产测试中关注焊接温度曲线与湿度敏感度等级(MSL)要求,确保长期可靠性。

七、采购与技术支持

选择 ICM-42688P-HXY 时,请通过华轩阳电子授权渠道采购以获得原厂质量保证与技术支持。如需样片测试或大批量供应,可联系销售代表获取最新的供货信息、技术手册与评估资料。对于硬件集成与固件调试,建议参考器件寄存器说明与示例驱动以加快开发进度。

如果需要,我可以根据您的开发平台(MCU 型号、接口选用、采样率需求)给出更具体的接线建议与初始化配置示例。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.