WMSIC Electronic Components

HXY MOSFET DS18B20

ModelDS18B20
PackageTO-92
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET DS18B20
Type
HXY MOSFET
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
DS18B20
Electronic Component
1
Package
TO-92
Electronic Component
Temperature Sensor
Electronic Component
±0.4℃
Electronic Component
0.219g
Electronic Component
1
Features
Output;; Low Power
Electronic Component
BM0228150209
Operating Voltage
2.5V~5.5V
Current
1uA
Interface Type
Bus
Electronic Component
55℃~+125℃
Resolution
12bit

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DS18B20 产品概述

一、产品简介

DS18B20 是一种数字温度传感器,基于单总线(One-Wire)协议进行通信,体积小、功耗低、精度高,适合多点温度采集与长期运行的温度监测系统。该型号由 HXY MOSFET(华轩阳电子)推出,常见封装为 TO-92,便于插装与手工焊接。

二、主要参数

  • 温度测量范围:-55 ℃ ~ +125 ℃
  • 精度:±0.4 ℃
  • 工作电压:2.5 V ~ 5.5 V
  • 待机电流:1 µA(静态低功耗)
  • 接口类型:单总线(One-Wire)
  • 温度转换时间:400 ms(12-bit 分辨率)
  • 温度分辨率:12 bit(最小分辨率 0.0625 ℃)

三、封装与品牌

  • 品牌:HXY MOSFET(华轩阳电子)
  • 常见封装:TO-92(便于线缆连接、插板与原型开发)
    该封装便于在通孔 PCB 或面包板上快速验证与小批量应用。

四、功能与特点

  • 数字输出,直接读取温度值,无需外部 ADC。
  • 单总线支持多节点挂载,最多可在同一信号线上挂接多个器件(需唯一 ROM 地址)。
  • 支持低功耗待机,适合电池供电或长期监测场景。
  • 高分辨率 12-bit,能达到 0.0625 ℃ 的最小步进;转换时间在满分辨率时约为 400 ms。
  • 耐宽温度范围,适应工业与环境监测要求。

五、典型应用场景

  • 温度记录与环境监测(机房、温室、冷链监控)
  • 家用电器与 HVAC 系统温度采集
  • 工业控制与传感器网络节点
  • 便携式与电池供电的温度监测设备

六、接口与使用建议

  • 通信:单总线协议,需拉高线使用上拉电阻(典型 4.7 kΩ,电源 5 V 时常用)。
  • 供电方式:可使用正常供电或寄生供电(寄生供电会影响响应速度与稳定性,推荐能独立供电时优先使用独立 VDD)。
  • 多点布线:若总线较长或节点较多,应注意线缆阻抗与上拉电阻值的匹配,必要时使用总线驱动或局部缓冲。
  • 分辨率设置:默认 12-bit,若需更快响应可降低分辨率以减少转换时间。

七、设计注意事项与排查要点

  • 精度受安装位置与热阻影响,传感器应与被测物良好热接触并避开热源干扰。
  • 长线环境下易受干扰,建议在关键节点做滤波与去耦(VDD 旁并联 0.1 µF)。
  • 若出现通信不稳定,先检查上拉电阻值、线缆连接与地线回路,再检验器件 ROM 地址冲突。
  • 对于安全关键或需高精度场合,建议出厂后做现场标定或温度校准。

八、采购与质量建议

  • 选择正规渠道采购,核验器件外观与标签(品牌、封装、批次)。
  • 批量采购前建议先做样片测试(温漂、精度、通信稳定性),并保留供应商质保与技术支持信息。
  • 对于长期使用,关注存储条件与焊接温度,避免高温回流损伤封装与内部元件。

小结:HXY MOSFET 提供的 DS18B20(TO-92)以其宽温度范围、低功耗与单总线便利性,适合多种温度监测应用。按上述接口与布线建议设计,可保证稳定可靠的温度测量性能。

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