WMSIC Electronic Components

HXY MOSFET 78L08

Model78L08
PackageSOT-89
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET 78L08
Type
HXY MOSFET
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
54uV
Electronic Component
78L08
Electronic Component
1
Package
SOT-89
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.156g
Electronic Component
1
Electronic Component
BM0258662159
Operating Voltage
30V
Output
Electronic Component
Output Voltage
8V
Output Current
100mA
Output Type
Electronic Component
Output Channel Count
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HXY MOSFET 78L08(SOT-89)产品概述

一、产品简介

HXY MOSFET(华轩阳电子)出品的78L08是一款固定输出型线性低压差稳压器(LDO),输入端最高耐压30V,固定输出电压8.0V,最大输出电流100mA。该器件为正极输出、单通道设计,SOT-89小封装,适合需要稳定8V电源且空间受限的应用场合。

二、主要性能与特点

  • 输出电压:8.0V(固定)
  • 最大输入电压:30V
  • 最大输出电流:100mA
  • 电源纹波抑制比(PSRR):46dB @ 120Hz(对纹波抑制能力强)
  • 输出噪声:54µV(低噪声,适合对干扰敏感的电路)
  • 封装:SOT-89,尺寸小、易于安装
  • 输出极性:正极,单通道输出

三、电气参数要点与热管理

  • 尽管最大输入可达30V,但功耗随电压差和输出电流显著增加。功耗Pd ≈ (Vin − 8V) × Iout。例如在Vin = 30V、Iout = 100mA时,Pd ≈ 2.2W,这对于SOT-89封装来说热耗较大,需特别重视散热与环境温升。
  • 建议工作时尽量减小Vin与Vout之间的差值,或在高电压条件下限制输出电流,必要时采用外部散热片或改用热性能更好的封装以确保可靠工作。

四、典型应用场景

  • 传感器电源、参考电源:低噪声特性方便驱动精密模拟前端
  • 小功率嵌入式设备、微控制器和接口电路的点对点稳压
  • 工业控制与仪表的辅助电源
  • 消费电子中对尺寸和成本敏感的固定电压供电场景

五、设计与使用建议

  • 稳定性电容:在输入端靠近器件引脚放置0.1µF陶瓷旁路电容;输出端建议10µF左右的低ESR电容(钽电容或低ESR电解/陶瓷),有利于稳定性与瞬态响应。具体电容值和ESR应参照器件数据手册。
  • 布局建议:输入旁路电容须尽可能靠近输入引脚放置,输出电容靠近输出引脚并良好接地;将热量导出路径(GND面或铜箔)做宽处理以帮助散热。
  • 保护措施:若系统可能出现反向电压、输入瞬变或输出短路,建议在输入端添加适当的限流或过压保护电路,并考虑放置反向二极管保护LDO免受输出回灌损害。

六、封装与可靠性

SOT-89小封装便于表贴与空间受限的板级应用,但热阻较大。在长期高温或高压差工况下,应评估结温并采取必要散热措施。器件符合常见工业级使用需求,但具体温度范围与可靠性指标请参照HXY MOSFET提供的详细资料与规范。

七、选型与采购提示

在选型时,确认系统最大输入电压、最大负载电流及允许的功耗、散热条件。若负载电流经常接近100mA或输入与输出电压差较大,建议评估散热或选择更高功率封装/更低压降的LDO。采购时参考完整型号、批次和数据手册,确保器件为正品并关注封装为SOT-89。

如需典型电路图、测试数据或与替代器件的对比(如更低噪声或更低压差型号),可以提供具体应用场景,我可进一步给出具体设计建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.