WMSIC Electronic Components

HXY MOSFET HT7833

ModelHT7833
PackageSOT-89
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET HT7833
Type
HXY MOSFET
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
195mV@(100mA)
Electronic Component
HXY MOSFET
Electronic Component
HT7833
Electronic Component
1
Package
SOT-89
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.14g
Electronic Component
1
Electronic Component
BM0257710782
Operating Temperature
25℃~+80℃
Operating Voltage
10V
Output
Electronic Component
Output Voltage
3.3V
Output Current
450mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HT7833 产品概述

一、简介

HT7833 是华轩阳电子(HXY MOSFET)推出的一款固定输出 3.3V 线性稳压器(LDO),单通道正极输出,采用 SOT-89 小封装。器件面向低功耗、对噪声和电源纹波有较高抑制要求的便携与嵌入式应用,具有过流保护与短路保护,适合在资源受限的空间内实现稳定的 3.3V 电源。

二、主要规格

  • 输出类型:固定(3.3V)
  • 最大输出电流:450 mA
  • 典型工作电压(输入参考):10V(支持常见 12V 系统供电)
  • 压差(Dropout):195 mV @ 100 mA
  • 静态工作电流(Iq):2 μA(典型,空载下极低功耗)
  • 电源纹波抑制比(PSRR):65 dB @ 1 kHz(对中频纹波有良好抑制)
  • 保护功能:过流保护、短路保护
  • 工作温度范围:-25 ℃ ~ +80 ℃
  • 封装:SOT-89,单通道正极输出

三、关键特性与优势

  • 低压差:在轻载到中等负载(例如 100 mA)时压差仅约 195 mV,有利于在电池或 5V/3.7V 等有限输入电压下提高效率。
  • 超低静态电流:2 μA 静态电流非常适合电池供电或待机功耗敏感的系统,延长待机时间。
  • 良好 PSRR:65 dB@1 kHz 能有效抑制来自开关电源或其他噪声源的中频干扰,改善模拟/射频电路性能。
  • 完善保护:内置过流与短路保护,简化外围保护电路设计,提高系统可靠性。
  • 小尺寸封装:SOT-89 便于空间受限的应用板上布局与自动化贴装。

四、封装与引脚

HT7833 采用 SOT-89 小封装,适合表面贴装。常见 SOT-89 LDO 引脚排列为 IN/GND/OUT(或类似排列),但不同厂商具体引脚定义可能存在差异,建议在设计前以该器件的正式数据手册为准,确认引脚定义与封装图。

五、电气与散热设计建议

  • 输入/输出旁路:在输入端及输出端分别放置低 ESR 陶瓷电容(建议 1 μF ~ 10 μF,X7R/Z5U 视具体温漂与 ESR 要求而定),并将输出电容尽量靠近稳压器引脚以保证稳定性与瞬态响应。若负载为高频开关或长导线,输入侧建议并联更大容量的电解或固态电容以降低纹波。
  • 布局及散热:线性稳压器的功耗按 P = (Vin − Vout) × Iout 计算。在高 Vin 或高 Iout 条件下,器件会产生较大热量,应在 PCB 上留出散热铜箔、尽量缩短输入/输出走线并增加与接地的热过孔,以保持结温在安全范围内。
  • 保护与测试:尽管器件具备过流/短路保护,长期在接近限制条件下工作仍会导致过热或寿命下降,推荐在系统设计中预留热测点并进行热分析。

六、典型应用场景

  • 物联网终端、传感器节点与可穿戴设备(低静态电流有利于延长电池寿命);
  • 嵌入式单板、MCU 供电及模拟前端供电(高 PSRR 有助于降低噪声影响);
  • 工业控制与仪表中对 3.3V 稳定电源的需求场合,且空间受限时优先选择 SOT-89 封装方案。

七、设计注意事项

  • 在实际设计中请以 HT7833 的完整数据手册为准,确认最大输入电压、输出电流的热限及引脚定义;
  • 注意压差随负载电流增加而上升,若需要在接近最大输出电流时保持稳定输出,应确保输入电压有足够裕量并做好散热;
  • 对于对纹波或瞬态要求苛刻的系统,合理配置输出电容与旁路网络,并在关键节点测量验证。

总结:HT7833 集合了低压差、超低静态电流、较高 PSRR 与保护功能,适合对功耗和噪声敏感且空间受限的 3.3V 供电应用。推荐在设计前仔细阅读器件数据手册并在目标载板上进行热与动态性能验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.