WMSIC Electronic Components

HXY MOSFET HXL1509-3.3

ModelHXL1509-3.3
PackageSOP-8
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET HXL1509-3.3
Type
HXY MOSFET
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
HXL1509-3.3
Electronic Component
1
Package
SOP-8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.121g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0258661876
Operating Temperature
40℃~+125℃
Operating Voltage
4.5V~40V
Switching Frequency
150kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HXL1509-3.3 产品概述

一、主要规格与性能特点

HXL1509-3.3 是华轩阳电子(HXY MOSFET)推出的一款降压型开关稳压器,固定输出 3.3V,最大输出电流 3A。器件内置开关管,工作电压范围宽(4.5V~40V),开关频率 150kHz,工作温度范围 -40℃~+125℃,静态电流约 10mA。采用 SOP-8 封装,非同步整流结构,适用于对成本、耐压及宽输入电压有要求的中功率降压场合。

主要特点总结:

  • 输入电压范围:4.5V ~ 40V,适用汽车和工业电源。
  • 输出:固定 3.3V,最大输出电流 3A(受封装散热限制)。
  • 开关频率:150kHz,在体积和效率之间取得折衷。
  • 非同步整流:需要外接肖特基整流二极管以提高整机效率和降低反向恢复损耗。
  • 静态电流约 10mA,适合对省电有一定要求但非超低功耗场合。

二、典型电气参数与工作条件

  • 拓扑:降压(Buck)
  • 输出通道:1 路固定输出(3.3V)
  • 开关管:内置(外部不需驱动 MOSFET)
  • 同步整流:否(需外接肖特基二极管)
  • 静态电流:约 10mA
  • 封装:SOP-8(注意 PCB 散热设计)

工作场景下请关注最大功耗与结温,SOP-8 封装的散热能力需要通过 PCB 铜箔及散热设计配合使用,以保证在输出 3A 时器件不过热。

三、典型应用场景

  • 汽车电子(车载辅助电源、传感器供电)—— 利用 4.5–40V 的输入范围直接适配车用电源。
  • 工业控制与通信设备(模块电源、传感器供电)。
  • 电池供电或电源管理系统,需要将较高电压降至稳定 3.3V 的场合。

四、外部元件与应用建议

  • 整流二极管:选择低正向压降、高速肖特基,额定电流建议 ≥ 4A,耐压根据最大输入电压选型(例如 ≥ 40V)。
  • 电感:建议在 6µH~33µH 范围内选型,电流饱和值要大于 3A。按目标电流纹波 ΔI ≈ 30% Iout 估算:
    • 例如 Vin=12V,Vout=3.3V,f=150kHz,ΔI≈0.9A 时: L ≈ (Vin−Vout)·D / (ΔI·f) ≈ 17.7µH(D=Vout/Vin)
  • 输出电容:推荐多颗低 ESR 陶瓷电容并联(例如 22µF~100µF),以降低输出纹波并保证瞬态响应。
  • 输入电容:高频低 ESR 陶瓷(例如 10µF~47µF)并配合电解或固态电容处理低频纹波与浪涌。
  • 布线与布局:输入电容尽量靠近 VIN-GND,引脚短而粗;开关节点(SW)到电感、肖特基的走线尽量短,减小环路面积。

五、PCB 布局与散热注意事项

  • SOP-8 封装需良好热铜层(建议 VIN/GND 区域加大铜箔面积并增加过孔导热至内层或背面散热)。
  • 开关节点走线短且避开敏感模拟线路,减少电磁干扰(EMI)。
  • 输入滤波器与输出电容靠近器件引脚放置,地线采用单点或平面接地以降低噪声。
  • 在高输出电流或高环境温度下,需评估结温并可能降低输出电流或增加散热措施。

六、选型与工程注意

  • 由于为非同步降压,整机效率在高电流或高 Vin 时会受肖特基损耗影响;对高效率有严格要求时可考虑同步整流器替代。
  • 若需更低静态电流或更高集成度(例如内置肖特基或更高频率),可参考其它降压器方案。选型时关注封装热阻、输入范围、开关频率与外部元器件匹配。
  • 设计时建议做热仿真与实际上板测试,包括负载调节、输出纹波、启动特性与短路保护等验证。

如需基于特定输入源(例如 12V 或 24V)给出参考 BOM、典型电感、电容与肖特基型号建议,我可以根据具体工况进一步算例与推荐。

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