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HXY MOSFET FR107
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HXY MOSFET FR107
- Type
- HXY MOSFET
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HXY MOSFET
- Electronic Component
- FR107
- Electronic Component
- 1
- Package
- SOD-123F
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.079g
- Electronic Component
- 1
- Electronic Component
- BM0257677132
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 5uA@1kV
- (Vf)
- 1.3V@1A
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FR107 产品概述
一、概述
FR107 为华轩阳电子（HXY MOSFET）提供的一款独立式快恢复/高效率整流二极管，型号标称 FR107。器件为单只封装，采用 SOD-123F 表贴封装，额定正向电流 1A，直流反向耐压 1kV，典型正向压降 1.3V（在 1A 条件下）。设计上侧重于高压耐受与较快的恢复特性，适用于高压整流与开关电源回路的高效整流需求。
二、主要参数
- 型号：FR107
- 品牌：HXY MOSFET（华轩阳电子）
- 封装：SOD-123F（表面贴装，独立式）
- 额定正向电流（If）：1A
- 正向压降（Vf）：约 1.3V @ 1A
- 反向耐压（Vr）：1000V（直流）
- 类型：快恢复 / 高效率二极管
三、性能特点
- 高电压耐受：1kV 的反向电压规格使其可用于高压整流与保护场合。
- 快恢复特性：相较于普通整流二极管，减小反向恢复时间与恢复电荷，有利于降低开关损耗与电磁干扰（EMI）。
- 低压降工作：1A 工作点时 Vf≈1.3V，在高频开关或整流场合能有效降低功耗。
- 表贴封装：SOD-123F 适合面向高密度 SMT 工艺的小型化电路板布置。
四、典型应用
- 开关电源（SMPS）整流与回收电路的输出整流或快速回路。
- 高压整流、电源输入侧防倒灌与续流。
- 逆变器与功率变换器的保护与吸能。
- 工业控制、电表、照明驱动等需高压整流且占板面积受限的应用。
五、封装与热管理注意
SOD-123F 为小型表贴封装，热阻相对较大，长时间在 1A 工作或脉冲连续工作时需关注 PCB 散热设计。建议：
- 在焊盘处增加铜箔面积作为散热片。
- 在高温环境或连续高电流场合对额定电流进行降额处理。
- 关注焊接工艺以避免热应力损害封装。
六、选型与使用建议
- 依据实际应用选择是否需要更低 Vf 或更高电流规格的器件；若工作电流高于 1A，应选用额定电流更大的型号或并联多只并合理考虑均流。
- 对于高频开关场合，若对反向恢复指标有严格要求，请参阅厂家完整数据手册获取恢复时间与恢复电荷等详细参数。
- 提供合适的旁路与吸收网络以抑制开关瞬态，保护二极管免受过压及过热。
七、储存与可靠性
建议按照厂家封装和运输规范储存，避免潮气、静电与机械冲击；在 SMT 贴装前如封装经过潮解处理，应参照回流焊曲线与干燥箱处理规范进行焊接。
总结：HXY FR107（SOD-123F）是面向高压、高效整流需求的快恢复二极管，适用于体积受限且需耐 1kV 反压的应用场景；在实际设计中需注意封装散热与降额策略，以保证长期可靠运行。若需更详细的电气参数（如反向漏电、恢复时间、最大结温等），建议索取华轩阳电子的完整数据手册。
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