WMSIC Electronic Components

HXY MOSFET 74HC595D

Model74HC595D
PackageSOP-16
BrandHXY MOSFET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HXY MOSFET 74HC595D
Type
HXY MOSFET
Minimum package
2500 圆盘

Technical parameters

Electronic Component
to
Electronic Component
Electronic Component
Electronic Component
HXY MOSFET
Electronic Component
74HC595D
Electronic Component
1
Package
SOP-16
Electronic Component
positions Register
Electronic Component
74HC
Electronic Component
0.301g
Electronic Component
1
Features
Output
Electronic Component
BM0219881889
Operating Temperature
40℃~+85℃
Operating Voltage
2V~6V
Output Type
Electronic Component
Clock Frequency(fc)
60MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74HC595D 产品概述

一、产品简介

74HC595D是一款广泛应用于电子产品设计中的8位串行输入/并行输出移位寄存器,也被称为串行输入/并行输出(SIPO)移位寄存器。该器件具有高效的数字信号处理功能,通常用于扩展微控制器或其他数字电路的输出端口,进而控制更复杂的外围设备,如LED驱动、数码管显示等。

74HC595D 采用SOP-16封装,其引脚排列紧凑,使其适合于空间有限的应用场合。该器件的工作电压范围为2V至6V,具有高频率的响应特性,使其在高速数字电路中表现出色。

二、主要功能

  • 8位数据输出:74HC595D具备8位并行输出,支持将数据从串行输入转化为并行输出,能够实现多路控制。
  • 串行输入:通过串行输入,可以将数据逐位输入,同时高效利用微控制器的I/O引脚,实现数据传输简化。
  • 锁存功能:器件内嵌锁存器,可以保持输出状态,确保数据的稳定性和可靠性,特别在多次输出情况下有助于减少误操作。
  • 移位功能:每当时钟信号上升沿出现,输入数据就会被移位到输出寄存器中,支持动态数据控制。
  • 级联连接:多个74HC595D可以级联连接,形成更大位数的并行输出,适用于更复杂的应用需求。

三、典型应用场景

  • LED驱动:通过74HC595D,可以轻松地控制多个LED的开关,适用于LED显示屏或LED装饰灯具的设计。
  • 数码管显示:在数码管应用中,74HC595D可以用来控制多位数码管的段选,简化控制线路并降低成本。
  • 马达控制:可用于控制电机驱动器的各种功能,如方向、启停等,通过并行输出实现复杂控制。
  • 音频设备:在音频处理设备中,可用于控制选择不同的音效或信号路径,提升用户体验。

四、技术参数

  • 工作电压范围: 2V-6V
  • 输出电流: 每个输出引脚最大可承受20mA,符合大多数普通应用需求。
  • 传输速率: 可支持高速操作,在典型条件下可达到高达25MHz的频率。
  • 环境工作温度: -40°C至+85°C,适应不同环境下的工作需求。

五、优势与特点

  • 高性能:74HC595D基于CMOS技术,具备低功耗、高速的特性,适合各种高效电路设计。
  • 简化设计:通过串行输出方式,显著减少对I/O引脚的需求,简化电路设计,提高了设计的灵活性。
  • 易于使用:使用标准的时钟和数据输入方式,便于与各种微控制器接口配合使用,降低设计难度。

六、注意事项

在使用74HC595D时,设计者需要注意电源的稳压条件,以确保电路的稳定性。同时,要合理配置电流源,以防对输出引脚造成过载损害。此外,进行级联连接时,应考虑时序与逻辑设计,避免数据丢失或错误。

七、总结

74HC595D作为一款功能强大且灵活的移位寄存器,凭借其卓越的性能和多样的应用场景,成为了现代电子设备中不可或缺的基础元器件之一。它的高效数据处理能力和简便的控制方式,帮助设计者节省空间与时间,快速实现复杂的功能需求。在未来的电子设计中,74HC595D依然将会扮演重要的角色,为创新型应用提供强有力的支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.